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TPS386596L33DGKR Datasheet(PDF) 2 Page - Texas Instruments |
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TPS386596L33DGKR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 12 page TPS386596L33 SLVSA75 – JULY 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. Custom threshold voltages from 0.80V to 4.6V, 4.8V to 6.0V are available through the use of factory EEPROM programming. Minimum order quantities apply. Contact factory for details and availability. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) TPS386596 UNIT Input voltage range, VCC –0.3 to 7.0 V Other voltage ranges: VMR, VSENSE1, VSENSE2, VSENSE3, VSENSE4, VRESET –0.3 to 7.0 V RESETpin current 5 mA ESD rating, HBM 2 kV ESD rating, CDM 500 V Continuous total power dissipation See Thermal Information Table Operating virtual junction temperature range, TJ –40 to 150 °C Operating ambient temperature range, TA –40 to 125 °C Storage temperature range, Tstg –65 to 150 °C (1) Stresses beyond those listed under Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. (2) As a result of the low dissipated power in this device, it is assumed that TJ = TA THERMAL INFORMATION TPS386596 THERMAL METRIC(1) UNITS DGK (8 PINS) qJA Junction-to-ambient thermal resistance 183.8 qJCtop Junction-to-case (top) thermal resistance 70.7 qJB Junction-to-board thermal resistance 72.8 °C/W yJT Junction-to-top characterization parameter 4.9 yJB Junction-to-board characterization parameter 68.4 qJCbot Junction-to-case (bottom) thermal resistance n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPS386596L33 |
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