Knowles Acoustics,

a division of Knowles Electronics, LLC.

Revision: C

8 of 10

SPM0103ND3

11. SOLDER REFLOW PROFILE

12. ADDITIONAL NOTES

Notes:

1.

Do not pull a vacuum over the port hole of the microphone. Pulling a

vacuum over the port hole can damage the device.

2.

Do not board wash after the reflow process. Board washing and

cleaning agents can damage the device. Do not expose to ultrasonic

processing or cleaning.

3.

Number of Reflow = recommend no more than 3 cycles.

30 sec.

260 C maximum

Peak

100 sec.

Above 230 C

Solder Melt

120 sec.

170 ~ 180 C

Pre-heat

Time (maximum)

Temperature Profile

Stage

170–180°C

Solder Melt

Pre-heat

260°C

230°C

100 sec.

120 sec.

(A)

Packaging (reference SiSonic_Packaging_Spec.pdf)

(B)

Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened

ESD moisture sensitive bag under maximum environmental conditions of 30º C, 70% R.H.

(C)

Exposure: Devices should not be exposed to high humidity, high temperature environment.

MSL (moisture sensitivity level) Class 2A.

(D)

Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum

conditions of 30ºC/70% R.H.