SPM0405HE4H

CONFI DENTI AL – DO NOT DI STRI BUTE

Know les Acou st ics, a division of Kn ow les

Elect r onics, LLC.

Revision: D

9 of 11

Notes:

1.

Do not pull a vacuum over the port hole of the microphone. Pulling a

vacuum over the port hole can damage the device.

2.

Do not board wash after the reflow process. Board washing and

cleaning agents can damage the device. Do not expose to ultrasonic

processing or cleaning.

3.

Number of Reflow = recommend no more than 3 cycles.

(A)

Packaging (reference SiSonic_Packaging_Spec.pdf)

(B)

Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened

ESD moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.

(C)

Exposure: Devices should not be exposed to high humidity, high temperature environment.

MSL (moisture sensitivity level) Class 2A.

(D)

Out of bag: Maximum of 90 days out of ESD moisture sensitive bag, assuming maximum

conditions of 30ºC/70% R.H.

11. MAXIMUM SOLDER REFLOW PROFILE

12. ADDITIONAL NOTES

Stage

Temperature Profile

Time (maximum)

Pre-heat

170 ~ 180 C

120 sec.

Solder Melt

Above 230 C

100 sec.

Peak

260 C maximum

30 sec.

170–180°C

Solder Melt

Pre-heat

260°C

230°C

100 sec.

120 sec.