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NCV4276BDTADJRKG Datasheet(PDF) 9 Page - ON Semiconductor |
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NCV4276BDTADJRKG Datasheet(HTML) 9 Page - ON Semiconductor |
9 / 12 page NCV4276B http://onsemi.com 9 Thermal Model A discussion of thermal modeling is in the ON Semiconductor web site: http://www.onsemi.com/pub/collateral/BR1487−D.PDF. Table 1. DPAK 5−Lead Thermal RC Network Models Drain Copper Area (1 oz thick) 168 mm2 736 mm2 168 mm2 736 mm2 (SPICE Deck Format) Cauer Network Foster Network 168 mm2 736 mm2 Units Tau Tau Units C_C1 Junction GND 1.00E−06 1.00E−06 W−s/C 1.36E−08 1.361E−08 sec C_C2 node1 GND 1.00E−05 1.00E−05 W−s/C 7.41E−07 7.411E−07 sec C_C3 node2 GND 6.00E−05 6.00E−05 W−s/C 1.04E−05 1.029E−05 sec C_C4 node3 GND 1.00E−04 1.00E−04 W−s/C 3.91E−05 3.737E−05 sec C_C5 node4 GND 4.36E−04 3.64E−04 W−s/C 1.80E−03 1.376E−03 sec C_C6 node5 GND 6.77E−02 1.92E−02 W−s/C 3.77E−01 2.851E−02 sec C_C7 node6 GND 1.51E−01 1.27E−01 W−s/C 3.79E+00 9.475E−01 sec C_C8 node7 GND 4.80E−01 1.018 W−s/C 2.65E+01 1.173E+01 sec C_C9 node8 GND 3.740 2.955 W−s/C 8.71E+01 8.59E+01 sec C_C10 node9 GND 10.322 0.438 W−s/C sec 168 mm2 736 mm2 R’s R’s R_R1 Junction node1 0.015 0.015 C/W 0.0123 0.0123 C/W R_R2 node1 node2 0.08 0.08 C/W 0.0585 0.0585 C/W R_R3 node2 node3 0.4 0.4 C/W 0.0304 0.0287 C/W R_R4 node3 node4 0.2 0.2 C/W 0.3997 0.3772 C/W R_R5 node4 node5 2.97519 2.6171 C/W 3.115 2.68 C/W R_R6 node5 node6 8.2971 1.6778 C/W 3.571 1.38 C/W R_R7 node6 node7 25.9805 7.4246 C/W 12.851 5.92 C/W R_R8 node7 node8 46.5192 14.9320 C/W 35.471 7.39 C/W R_R9 node8 node9 17.7808 19.2560 C/W 46.741 28.94 C/W R_R10 node9 GND 0.1 0.1758 C/W C/W NOTE: Bold face items represent the package without the external thermal system. Junction R1 C1 C2 R2 C3 R3 Cn Rn Time constants are not simple RC products. Amplitudes of mathematical solution are not the resistance values. Ambient (thermal ground) Figure 13. Grounded Capacitor Thermal Network (“Cauer” Ladder) Junction R1 C1 C2 R2 C3 R3 Cn Rn Each rung is exactly characterized by its RC−product time constant; amplitudes are the resistances. Ambient (thermal ground) Figure 14. Non−Grounded Capacitor Thermal Ladder (“Foster” Ladder) |
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