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NCV8518BPWR2G Datasheet(PDF) 4 Page - ON Semiconductor |
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NCV8518BPWR2G Datasheet(HTML) 4 Page - ON Semiconductor |
4 / 13 page NCV8518B http://onsemi.com 4 MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage VIN −0.3 to 45 V ENABLE Voltage (ENABLE may be connected to VIN through an external 20k resistor without damage) VENABLE −0.3 to 16 V Output Voltage VOUT −0.3 to +7.0 V RESET Voltage VRESET 0 V to VOUT V RESET Current (RESET may be incidentally shorted either to VOUT or to GND without damage) IRESET Internally Limited mA ESD Susceptibility (Human Body Model) − 2.0 kV Logic Inputs/Outputs (Reset, WDI, Wake Up, Delay) − −0.3 to +7.0 V Operating Junction Temperature TJ −40 to150 °C Storage Temperature Range TS −55 to +150 °C Moisture Sensitivity Level SOIC−16 EP (Case 751R) SOIC−8 EP (Case 751AC) MSL 1 3 Lead Temperature Soldering: Reflow Leaded Part 60−150 sec above 183°C, 30 sec max at peak Lead−Free Part 60−150 sec above 217°C, 40 sec max at peak − − 240 peak 265 peak °C °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Parameter Board/Mounting Conditions Typical Value Unit SO−8 Exposed Pad Package 100 sq. mm spreader board (Note 1) 1 sq. inch spreader board (Note 2) Junction to case top (YJT) 14 14 °C/W Junction to lead1 (YJL1) 36 26 °C/W Junction to board (YJB) (Note 3) 15 14 °C/W Junction to ambient (qJA) 126 80 °C/W SO−16 Exposed Pad Package 100 sq. mm spreader board (Note 1) 1 sq. inch spreader board (Note 2) Junction to case top (YJT) 20 20 °C/W Junction to lead1 (YJL1) 41 26 °C/W Junction to board (YJB) (Note 3) 12 12 °C/W Junction to ambient (qJA) 113 70 °C/W Specific notes on thermal characterization conditions: All boards are 0.062” thick FR4, 3” square, with varying amounts of copper heat spreader, in still air (free convection) conditions. Numerical values are derived from an axisymmetric finite−element model where active die area, total die area, flag area, pad area, and board area are equated to the actual corresponding areas. 1. 1 oz copper, 100 mm2 (0.155 in2) spreader area (includes exposed pad). 2. 1 oz copper, 645 mm2 (1 in2) spreader area (includes exposed pad). 3. “board” is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it best represents the primary heat flow path and is least sensitive to board and ambient properties. |
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