NDF02N60Z, NDP02N60Z, NDD02N60Z

http://onsemi.com

9

PACKAGE DIMENSIONS

STYLE 2:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

12

3

4

V

S

A

K

−T−

SEATING

PLANE

R

B

F

G

M

0.13 (0.005)

T

C

E

J

H

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.235

0.245

5.97

6.35

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.027

0.035

0.69

0.88

E

0.018

0.023

0.46

0.58

F

0.037

0.045

0.94

1.14

G

0.090 BSC

2.29 BSC

H

0.034

0.040

0.87

1.01

J

0.018

0.023

0.46

0.58

K

0.350

0.380

8.89

9.65

R

0.180

0.215

4.45

5.45

S

0.025

0.040

0.63

1.01

V

0.035

0.050

0.89

1.27

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

Z

Z

0.155

−−−

3.93

−−−

IPAK

CASE 369D−01

ISSUE B

DPAK

CASE 369AA−01

ISSUE A

STYLE 2:

PIN 1. GATE

2. DRAIN

3. SOURCE

4. DRAIN

D

A

B

R

V

S

F

L

2 PL

M

0.13 (0.005)

T

E

C

U

J

PLANE

Z

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.235

0.245

5.97

6.22

B

0.250

0.265

6.35

6.73

C

0.086

0.094

2.19

2.38

D

0.025

0.035

0.63

0.89

E

0.018

0.024

0.46

0.61

F

0.030

0.045

0.77

1.14

J

0.018

0.023

0.46

0.58

L

0.090 BSC

2.29 BSC

R

0.180

0.215

4.57

5.45

S

0.024

0.040

0.60

1.01

U

0.020

−−−

0.51

−−−

V

0.035

0.050

0.89

1.27

Z

0.155

−−−

3.93

−−−

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

12

3

4

H

0.386

0.410

9.80

10.40

H

5.80

0.228

2.58

0.101

1.6

0.063

6.20

0.244

3.0

0.118

6.172

0.243

mm

inches

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*