Electronic Components Datasheet Search |
|
LM3S8970-IQN50-A2T Datasheet(PDF) 9 Page - Texas Instruments |
|
LM3S8970-IQN50-A2T Datasheet(HTML) 9 Page - Texas Instruments |
9 / 554 page Figure 14-6. Data Validity During Bit Transfer on the I2C Bus ................................................... 353 Figure 14-7. Master Single SEND .......................................................................................... 356 Figure 14-8. Master Single RECEIVE ..................................................................................... 357 Figure 14-9. Master Burst SEND ........................................................................................... 358 Figure 14-10. Master Burst RECEIVE ...................................................................................... 359 Figure 14-11. Master Burst RECEIVE after Burst SEND ............................................................ 360 Figure 14-12. Master Burst SEND after Burst RECEIVE ............................................................ 361 Figure 14-13. Slave Command Sequence ................................................................................ 362 Figure 15-1. CAN Controller Block Diagram ............................................................................ 387 Figure 15-2. CAN Data/Remote Frame .................................................................................. 388 Figure 15-3. Message Objects in a FIFO Buffer ...................................................................... 396 Figure 15-4. CAN Bit Time .................................................................................................... 400 Figure 16-1. Ethernet Controller ............................................................................................. 435 Figure 16-2. Ethernet Controller Block Diagram ...................................................................... 435 Figure 16-3. Ethernet Frame ................................................................................................. 436 Figure 16-4. Interface to an Ethernet Jack .............................................................................. 442 Figure 17-1. 100-Pin LQFP Package Pin Diagram .................................................................. 482 Figure 17-2. 108-Ball BGA Package Pin Diagram (Top View) ................................................... 483 Figure 20-1. Load Conditions ................................................................................................ 515 Figure 20-2. JTAG Test Clock Input Timing ............................................................................. 517 Figure 20-3. JTAG Test Access Port (TAP) Timing .................................................................. 517 Figure 20-4. JTAG TRST Timing ............................................................................................ 518 Figure 20-5. External Reset Timing (RST) .............................................................................. 518 Figure 20-6. Power-On Reset Timing ..................................................................................... 519 Figure 20-7. Brown-Out Reset Timing .................................................................................... 519 Figure 20-8. Software Reset Timing ....................................................................................... 519 Figure 20-9. Watchdog Reset Timing ..................................................................................... 519 Figure 20-10. Hibernation Module Timing ................................................................................. 520 Figure 20-11. SSI Timing for TI Frame Format (FRF=01), Single Transfer Timing Measurement .................................................................................................... 521 Figure 20-12. SSI Timing for MICROWIRE Frame Format (FRF=10), Single Transfer ................. 522 Figure 20-13. SSI Timing for SPI Frame Format (FRF=00), with SPH=1 ..................................... 522 Figure 20-14. I2C Timing ......................................................................................................... 523 Figure 20-15. External XTLP Oscillator Characteristics ............................................................. 526 Figure D-1. 100-Pin LQFP Package ...................................................................................... 550 Figure D-2. 108-Ball BGA Package ...................................................................................... 552 9 June 22, 2010 Texas Instruments-Production Data Stellaris® LM3S8970 Microcontroller |
Similar Part No. - LM3S8970-IQN50-A2T |
|
Similar Description - LM3S8970-IQN50-A2T |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |