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NTLJD4116NT1G Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTLJD4116NT1G
Description  Power MOSFET
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTLJD4116NT1G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 4
1
Publication Order Number:
NTLJD4116N/D
NTLJD4116N
Power MOSFET
30 V, 4.6 A,
mCoolt Dual N−Channel,
2x2 mm WDFN Package
Features
WDFN Package Provides Exposed Drain Pad for Excellent Thermal
Conduction
2x2 mm Footprint Same as SC−88
Lowest RDS(on) Solution in 2x2 mm Package
1.5 V RDS(on) Rating for Operation at Low Voltage Gate Drive Logic
Level
Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
This is a Pb−Free Device
Applications
DC−DC Converters (Buck and Boost Circuits)
Low Side Load Switch
Optimized for Battery and Load Management Applications in
Portable Equipment such as, Cell Phones, PDA’s, Media Players, etc.
Level Shift for High Side Load Switch
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
±8.0
V
Continuous Drain
Current (Note 1)
Steady
State
TA = 25°C
ID
3.7
A
TA = 85°C
2.7
t
≤ 5 s
TA = 25°C
4.6
Power Dissipation
(Note 1)
Steady
State
TA = 25°C
PD
1.5
W
t
≤ 5 s
2.3
Continuous Drain
Current (Note 2)
Steady
State
TA = 25°C
ID
2.5
A
TA = 85°C
1.8
Power Dissipation
(Note 2)
TA = 25°C
PD
0.71
W
Pulsed Drain Current
tp = 10 ms
IDM
20
A
Operating Junction and Storage Temperature
TJ, TSTG
−55 to
150
°C
Source Current (Body Diode) (Note 2)
IS
2.0
A
Lead Temperature for Soldering Purposes
(1/8
″ from case for 10 s)
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
of 30 mm2, 2 oz Cu.
http://onsemi.com
30 V
90 m
W @ 2.5 V
70 m
W @ 4.5 V
RDS(on) MAX
4.6 A
ID MAX (Note 1)
V(BR)DSS
125 m
W @ 1.8 V
250 m
W @ 1.5 V
G
S
N−CHANNEL MOSFET
D
JF
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
JFM
G
G
1
2
3
6
5
4
WDFN6
CASE 506AN
MARKING
DIAGRAM
1
2
3
6
5
4
S1
G1
D2
D1
G2
S2
(Top View)
1
PIN CONNECTIONS
D1
D2
Device
Package
Shipping
ORDERING INFORMATION
NTLJD4116NT1G
WDFN6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.


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