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TLYM1108 Datasheet(PDF) 9 Page - Toshiba Semiconductor |
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TLYM1108 Datasheet(HTML) 9 Page - Toshiba Semiconductor |
9 / 15 page TL(RM,RMM,SM,OM,YM)1108(T11) 2010-01-29 9 Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopened within 12 months at the following conditions. Temperature: 5 °C to 30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 4weeks in an environment of 5°C to 30°C/60% RH or below. 3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60 ±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering • Reflow soldering (example) • The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions. • Please perform the first reflow soldering with reference to the above temperature profile and within 4weeks of opening the package. • Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30 °C, 60% RH (max) • Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron: 25 W Temperature: 350 °C or less Time: within 3 s • If the products need to be performed by other soldering method (ex. wave soldering), please contact Toshiba sales representative. 60 to 120 s 10 s max 240 °C max 4 °C/s max 140 to 160 °C 4 °C/s max Time (s) Temperature profile for Pb soldering (example) Time (s) Temperature profile for Pb-free soldering (example) 150 to 180 °C 4 °C/s max 5 s max 260 °C max 4 °C/s max 230 °C 60 to 120 s (*) (*) (*) (*) (*) (*) (*) (*) max (*) max (*) max (*) 30 to 50 s max (*) max (*) |
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