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TPCA8109 Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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TPCA8109 Datasheet(HTML) 2 Page - Toshiba Semiconductor |
2 / 7 page TPCA8109 2009-12-03 2 Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance, channel to case (Tc=25°C) Rth (ch-c) 4.17 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Rth (ch-a) 44.6 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Rth (ch-a) 78.1 °C/W Marking (Note 4) Note 1: Please use devices on condition that the channel temperature is below 150°C. Note 2: (a) Device mounted on a glass-epoxy board (a) (b) Device mounted on a glass-epoxy board (b) Note 3: VDD = −24 V, Tch = 25°C (initial), L = 100μH, RG = 25 Ω, IAR = -24 A Note 4: * TPCA 8109 Lot No. Type * Weekly code: (Three digits) Week of manufacture (01 for first week of year, continues up to 52 or 53) Year of manufacture (One low-order digits of calendar year) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (b) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (a) |
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