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SSTUB32864 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # SSTUB32864
Description  1.8 V configurable registered buffer for DDR2-800 RDIMM applications
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

SSTUB32864 Datasheet(HTML) 2 Page - NXP Semiconductors

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SSTUB32864_2
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 26 March 2007
2 of 19
NXP Semiconductors
SSTUB32864
1.8 V configurable registered buffer for DDR2-800 RDIMM applications
2.
Features
I Configurable register supporting DDR2 Registered DIMM applications
I Configurable to 25-bit 1 : 1 mode or 14-bit 1 : 2 mode
I Controlled output impedance drivers enable optimal signal integrity and speed
I Meets SSTUB32864 JEDEC specification speed performance
I Supports up to 450 MHz clock frequency of operation
I Optimized pinout for high-density DDR2 module design
I Chip-selects minimize power consumption by gating data outputs from changing state
I Supports SSTL_18 data inputs
I Differential clock (CK and CK) inputs
I Supports LVCMOS switching levels on the control and RESET inputs
I Single 1.8 V supply operation (1.7 V to 2.0 V)
I Available in 96-ball, 13.5 mm × 5.5 mm, 0.8 mm ball pitch LFBGA package
3.
Applications
I 400 MT/s to 800 MT/s DDR2 registered DIMMs without parity
4.
Ordering information
Table 1.
Ordering information
Tamb =0 °Cto+70 °C.
Type number
Solder process
Package
Name
Description
Version
SSTUB32864EC/G
Pb-free (SnAgCu
solder ball compound)
LFBGA96
plastic low profile fine-pitch ball grid array package;
96 balls; body 13.5
× 5.5 × 1.05 mm
SOT536-1


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