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ECEV16GR22R Datasheet(PDF) 5 Page - Panasonic Semiconductor |
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ECEV16GR22R Datasheet(HTML) 5 Page - Panasonic Semiconductor |
5 / 9 page Aluminum Electrolytic Capacitor Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/ or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail. – EE18 – 1.3 Common Application Conditions to Avoid The following misapplication load conditions will cause rapid deter ioration to capacitor electr ical par ameters. l n addition, rapid heating and gas generation within the capacitor can occur causing the pressure relief vent to operate and resuItant leakage of electrolyte. Under extreme conditions, explosion and fire could result. Leakinq electrolyte is combustible and electrically conductive. (1) Reverse Voltaqe DC capacitors have polarity. Verify correct polarity before inser tion. For circuits with changing or uncer tain polarity,use DC bipolar capacitors. DC bipolar capacitors are not suitable for use in AC circuits. (2) Charqe/Discharqe Applications Standard capacitors are not suitable for use in repeating charge/discharge applications. Fo r charqe/discharqe applications consult us and advise actual conditions. (3) Overvoltage Do not appIy voltaqes exceeding the maximum specified rated voltages. Voltage up to the surge voltage rating are acceptable for shor t periods of time. Ensure that the sum of the DC voltage and the super imposed AC r ipple voltage does not exceed the rated voltage. (4) Ripple Current Do not apply ripple currents exceeding the maximum specified value. For high ripple current applications, use a capacitor designed for high rippIe currents or contact us with your requirements. Ensure that allowable ripple currents superimposed on low DC bias voltages do not cause reverse voltage conditions. 1.4 Using Two or More Capacitors in Series or Parallel (1) Capacitors Connected in Parallel The circuit resistance can closely approximate the ser ies resistance of the capacitor causing an imbalance of r ipple current loads w i t h in the capacitors. Careful design of wiring methods can minimize the possibility of excessive ripple currents applied to a capacitor. (2) Capacitors Connected in Series Nor mal DC leakage curren t differences among capacitors can cause voltage imbalances. The use of voltage divider shunt resistors with consideration to leakage currents, can prevent capacitor voltage imbaIances. 1.5 Capacitor Mounting Considerations (1) DoubIe - Sided Circuit Boards Avoid wir ing Patter n r uns which pass between the mounted capacitor and the circuit board. When dipping into a solder bath, excess solder may collect under the capacitor b y capillar y action and shortcircuit the anode and cathode terminals. (2) Circuit Board Hole Positioning The vinyl sleeve of the capacitor can be damaged if solder passes through a lead hole f o r subsequently processed parts. Special care when locating hole positions in proximity to capacitors is recommended. (3) Circuit Board Hole Spacing The circuit board holes spacing should match the capacitor lead wire spacing within the specified tolerances. Incorrect spacing can cause excessive lead wire stress during the insertion process. This may resuIt in premature capacitor failure due to short or open circuit, increased leakage current, or electrolyte leakage. (4)Land/Pad Pattern The circuit board land/pad pattern size for chip capacitors is specified in the following table. [ Table of Board Land Size vs. Capacitor Size ] Among others, when the size a is wide , back fillet can not be made, decreasing fitting strength. h Decide considering mounting condition, solderability and fitting strength, etc. based on the design standards of your company. b a b c Board land part Size A( φ3) B( φ4) C( φ5) D( φ6.3) E( φ8 x 6.2L) F( φ8 x 10.2L) G( φ10 x 10.2L) a 0.6 1.0 1.5 1.8 2.2 3.1 4.6 b 2.2 2.5. 2.8 3.2 4.0 4.0 4.1 c 1.5 1.6 1.6 1.6 1.6 2.0 2.0 (mm) Mar. 2005 |
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