SSTVF16859_05 datasheet(2/23 Pages) PHILIPS

Part #	SSTVF16859

Description	13-bit 1 : 2 SSTL_2 registered buffer for DDR

Download	23 Pages

Scroll/Zoom	100%

Manufacturer	PHILIPS [NXP Semiconductors]

Direct Link	http://www.nxp.com

Logo

2 / 23 page

9397 750 15157

Product data sheet

Rev. 02 — 19 July 2005

2 of 23

Philips Semiconductors

SSTVF16859

13-bit 1 : 2 SSTL_2 registered buffer for DDR

2.

Features

s Stub-series terminated logic for 2.5 V VDD (SSTL_2)

s Designed for PC1600-PC2700 (at 2.5 V) and PC3200 (at 2.6 V) applications

s Pin and function compatible with JEDEC standard SSTV16859

s Supports SSTL_2 signal inputs as per JESD 8-9

s Flow-through architecture optimizes printed-circuit board layout

s ESD classiﬁcation testing is done to JEDEC Standard JESD22. Protection exceeds

2000 V to HBM per method A114.

s Latch-up testing is done to JEDEC Standard JESD78, which exceeds 100 mA

s Supports efﬁcient low power standby operation

s Full DDR solution when used with PCKVF857

s Available in TSSOP64, LFBGA96 and HVQFN56 packages

3.

Quick reference data

[1]

CPD is used to determine the dynamic power dissipation (PD in µW).

PD =CPD × VDD2 × fi + Σ (CL × VDD2 × fo) where:

fi = input frequency in MHz;

CL = output load capacitance in pF;

fo = output frequency in MHz;

VDD = supply voltage in V;

Σ (C

L × VDD

2

× f

o) = sum of the outputs.

4.

Ordering information

Table 1:

Quick reference data

GND = 0 V; Tamb =25 °C; tr =tf ≤ 2.5 ns

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

tPHL/tPLH

propagation delay,

CK/CK to Qn

CL =30pF;

VDD = 2.5 V

-

1.7

-

ns

Ci

input capacitance

VDD = 2.5 V

[1] -

2.8

-

pF

Table 2:

Ordering information

Tamb =0 °C to +70 °C

Type number

Package

Name

Description

Version

SSTVF16859BS

HVQFN56 plastic thermal enhanced very thin quad ﬂat package;

no leads; 56 terminals; body 8

× 8 × 0.85 mm

SOT684-1

SSTVF16859DGG TSSOP64 plastic thin shrink small outline package; 64 leads;

body width 6.1 mm

SOT646-1

SSTVF16859EC

LFBGA96

plastic low proﬁle ﬁne-pitch ball grid array package;

96 balls; body 13.5

× 5.5 × 1.05 mm

SOT536-1

Similar Part No. - SSTVF16859_05

Manufacturer	Part #	Datasheet	Description
NXP Semiconductors	SSTVF16859BS	129Kb / 15P	13-bit 1:2 SSTL_2 registered buffer for DDR 2004 Jul 12
	SSTVF16859DGG	129Kb / 15P	13-bit 1:2 SSTL_2 registered buffer for DDR 2004 Jul 12
	SSTVF16859EC	129Kb / 15P	13-bit 1:2 SSTL_2 registered buffer for DDR 2004 Jul 12

More results

Similar Description - SSTVF16859_05

Manufacturer	Part #	Datasheet	Description
NXP Semiconductors	SSTVF16859	129Kb / 15P	13-bit 1:2 SSTL_2 registered buffer for DDR 2004 Jul 12
NXP Semiconductors	SSTVN16859	116Kb / 11P	13-bit 1:2 SSTL_2 registered buffer for DDR 2004 Jul 15
Renesas Technology Corp	HD74SSTV16859	3Mb / 11P	1:2 13-bit SSTL_2 Registered Buffer
NXP Semiconductors	SSTV16859	124Kb / 14P	2.5 V 13-bit to 26-bit SSTL_2 registered buffer for stacked DDR DIMM 2002 Feb 19
Renesas Technology Corp	HD74SSTV16857B	3Mb / 16P	1:1 14-bit SSTL_2 Registered Buffer
	HD74SSTV16857	252Kb / 11P	1:1 14-bit SSTL_2 Registered Buffer
	HD74SSTV16857A	215Kb / 11P	1:1 14-bit SSTL_2 Registered Buffer
Texas Instruments	SN74SSTL16857	93Kb / 7P	[Old version datasheet] 14-BIT SSTL_2 REGISTERED BUFFER
Integrated Circuit Syst...	ICSSSTVA16859B	130Kb / 11P	DDR 13-Bit to 26-Bit Registered Buffer
Integrated Device Techn...	ICSSSTVA16859C	293Kb / 10P	DDR 13-Bit to 26-Bit Registered Buffer

More results

SSTVF16859 Datasheet(PDF) 2 Page - NXP Semiconductors

SSTVF16859 Datasheet(HTML) 2 Page - NXP Semiconductors

Similar Part No. - SSTVF16859_05

Similar Description - SSTVF16859_05

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Datasheet Download

Link URL