Chip Bead Cores

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.

Should a safety concern arise regarding this product, please be sure to contact us immediately.

C

AB

Preheating

Peak

Heating

Time

Recommendations and precautions are described below.

<Repair with hand soldering>

● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder

each electrode for 3 seconds or less.

● Never touch this product with the tip of a soldering iron.

Safety Precautions

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,

ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.

1. Flow soldering may cause this product to come off because the adhesiveness of the product element is low.

Please consult our sales representative in advance about flow soldering.

2. Use rosin-based flux or halogen-free flux.

3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person

in advance.

4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g.

pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance.

Excessive mechanical stress may damage the bead cores. Handle with care.

5. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a relative humidity of

40 % to 60 %, where there are no rapid changes in temperature or humidity.

6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the outgoing inspection

indicated on the packages.

Part Number

A

B

C

EXCCL4532U1

3

5.4

2.8

EXCCL3225U1

1.7

4.1

2.1

EXCCL3216U1

1.7

4.1

1.2

EXCML45A910H

2.6 to 3

5.5 to 6.5

1.2 to 1.6

EXCML32A680U

1.6 to 2

4 to 5

1.2 to 1.6

EXCML20A390U

0.8 to 1.2

3 to 4

1 to 1.2

EXCML16A270U

0.6 to 1

2 to 3

0.8 to 1

EXC3B

H

0.8 to 1

2 to 2.6

0.8 to 1

(mm)

Temperature

Time

Preheating

140 °C to 160 °C

60 s to 120 s

Main heating

Above 200 °C

30 s to 40 s

Peak

235 ± 10 °C

max. 10 s

Temperature

Time

Preheating

150 °C to 170 °C

60 s to 120 s

Main heating

Above 230 °C

30 s to 40 s

Peak

max. 260 °C

max. 10 s

● Recommended soldering conditions for reflow

For soldering (Example : Sn-37Pb)

For lead-free soldering (Example : Sn/3Ag/0.5Cu)

· Reflow soldering shall be performed a maximum of

two times.

· Please contact us for additional information when

used in conditions other than those specified.

· Please measure the temperature of the terminals

and study every kind of solder and printed circuit

board for solderability before actual use.

Jul. 2008