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EFSD836MJ1 Datasheet(PDF) 3 Page - Panasonic Semiconductor |
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EFSD836MJ1 Datasheet(HTML) 3 Page - Panasonic Semiconductor |
3 / 3 page Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. SAW Devices(SAW Duplexers) t1 P0 P2 t2 A P1 φD0 D E C A t W ● Embossed Carrier Taping ● Taping Reel J type J, K type K type ■ Packaging Methods (Taping) ● Minimum Quantity / Packing Unit Symbol A B C D E W t Dim. (mm) φ178±3 φ60.0±1.0 φ13.0±0.5 φ21.0±1.0 2.0±0.5 9.0±1.0 max. 3 Part Number Packaging Style Quantity Packaging Quantity in Carton Carton Dimensions in mm (L W H) EFSD J Embossed Carrier Taping 2000 pcs./reel 10000 pcs. 230×220×73 EFSD K Embossed Carrier Taping 2000 pcs./reel 10000 pcs. 230×220×73 Symbol W F E P0 P1 P2 D0 t1 t2 AB Dim. (mm) 8.0±0.2 3.50±0.05 1.75±0.10 4.0±0.1 4.0±0.1 2.00±0.05 φ1.50+0.1 0.25±0.05 0.70±0.10 2.3±0.1 2.8±0.1 –0 Symbol W F E P0 P1 P2 D0 t1 t2 AB Dim. (mm) 8.0±0.2 3.50±0.05 1.75±0.10 4.0±0.1 4.0±0.1 2.00±0.05 φ1.50+0.1 0.25±0.05 1.10±0.10 2.3±0.1 2.8±0.1 –0 Mar. 2010 |
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