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S6B1713A15-XXXN Datasheet(PDF) 8 Page - Samsung semiconductor |
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S6B1713A15-XXXN Datasheet(HTML) 8 Page - Samsung semiconductor |
8 / 70 page 65 COM / 132 SEG DRIVER & CONTROLLER FOR STN LCD S6B1713 4 PAD CONFIGURATION ððð ððððððððððððððððððð - - - - - - - - - - ððððððððððððððððððð ððð Y 148 287 147 288 111 324 110 1 S6B1713 (TOP VIEW) (0,0) X ðððððððððððððððððððððð - - - - - - - - - - ððððððððððððððððððððððð Figure 2. S6B1713 Chip Configuration Table 1. S6B1713 Pad Dimensions Size Items Pad No. X Y Unit Chip size - 10860 2920 1 to 110 90 Pad pitch 111 to 324 70 1 to 110 56 114 111 to 147 108 50 148 to 287 50 108 Bumped pad size 288 to 324 108 50 Bumped pad height 1 to 324 17 (Typ.) µm Figure 3. COG Align Key Coordinate Figure 4. ILB Align Key Coordinate(with Gold Bump *) 30 µm 30µm 30µm (-5065, +1302) 30 µm 30µm 30µm (+5065, +1317) 42 µm 108 µm (-5060, -1180) (+5060, -1180) 42 µm 108 µm * When designing electrode pattern must be prohibited on this area (ILB Align Key). If electrode pattern is used for routing over this area, it can be happened pattern-short through gold bump pattern on ILB Align Key. |
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