Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
71308-5404
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
|
71308-5406
|
1Mb / 5P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
|
71308-5408
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
|
71308-5410
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|
71308-5412
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
|