87911-1209 datasheet(3/7 Pages) MOLEX10 | 2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 2.50關m (98關) Tin (Sn) Overall Plating, Tube Packaging, Lead- free

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87911-1209 Datasheet(PDF) 3 Page - Molex Electronics Ltd.

Part #	87911-1209

Description	2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 2.50關m (98關) Tin (Sn) Overall Plating, Tube Packaging, Lead- free

Download	7 Pages

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Manufacturer	MOLEX10 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

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Similar Part No. - 87911-1209

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	87911-1207	498Kb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free

Similar Description - 87911-1209

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0879111014	197Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 10 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, Lead-free
	0879141216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 12 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879143416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142616	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879140816	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879144416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141816	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141616	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879143216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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