Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0878910306
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 3 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0878914006
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0878910408
|
299Kb / 5P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Vertical, 4 Circuit, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0878910106
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Vertical, 1 Circuit, 2.50 關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0878910206
|
770Kb / 10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Breakaway, Vertical, 2 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray Packaging, Lead-free
|
0879140616
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0879143416
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0879142616
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0879140816
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
0879144416
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|