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©2010 Littelfuse, Inc.

Revised: February 9, 2010

SPA™ Silicon Protection Array Products

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Low Capacitance ESD Protection Array

SP3002 Lead-Free/Green Series

Embossed Carrier Tape & Reel Specification - SC70-6

Symbol

Millimetres

Inches

Min

Max

Min

Max

E

1.65

1.85

0.064

0.073

F

3.45

3.55

0.135

0.139

P2

1.95

2.05

0.077

0.081

D

1.40

1.60

0.055

0.063

D1

1.00

1.25

0.039

0.049

P0

3.90

4.10

0.154

0.161

10P0

40.0+/- 0.20

1.574+/-0.008

W

7.70

8.10

0.303

0.318

P

3.90

4.10

0.153

0.161

A0

2.14

2.34

0.084

0.092

B0

2.24

2.44

0.088

0.096

K0

1.12

1.32

0.044

0.052

t

0.27 Max

0.010 Max

Ordering Information

Part Number

Package

Marking

Min. Order Qty.

SP3002-04HTG

SOT23-6

EX4

3000

SP3002-04JTG

SC70-6

EX4

3000

SP3002-04UTG

EX4

3000

Product Characteristics

Lead Plating

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Subsitute Material

Silicon

Body Material

Molded Epoxy

Flammability

UL94-V-0

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold flash & metal burr.

4. All specifications comply to JEDEC SPEC MO-223 Issue A

5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

6. Package surface matte finish VDI 11-13.

Part Numbering System

Part Marking System

SP3002-04XTG

Series

Package

H = SOT23-6

J = SC70-6

U = uDFN-6

T= Tape & Reel

G= Green

Silicon

Protection

Array

Number of Channels

-04 = 4 channel

Product Series

E = SP3002 series

Assembly Site

(varies)

Number of Channels