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©2010 Littelfuse, Inc.

Revised: February 9, 2010

SPA™ Silicon Protection Array Products

Specifications are subject to change without notice.

Please refer to http://www.littelfuse.com for current information.

Low Capacitance ESD Protection Array

SP3002 Lead-Free/Green Series

Package Dimensions - SC70-6

Package

SC70-6

Pins

6

JEDEC

MO-203 Issue A

Millimeters

Inches

Min

Max

Min

Max

A

0.80

1.10

0.031

0.043

A1

0.00

0.10

0.000

0.004

A2

0.70

1.00

0.028

0.039

B

0.15

0.30

0.006

0.012

c

0.08

0.25

0.003

0.010

D

1.85

2.25

0.073

0.089

E

1.15

1.35

0.045

0.053

e

0.65 BSC

0.026 BSC

HE

2.00

2.40

0.079

0.094

L

0.26

0.46

0.010

0.018

D

A2 A

A1

C

L

E

HE

2

1

3

6

5

4

e

e

B

Solder Pad Layout

Package Dimensions - SOT23-6

Package

SOT23-6

Pins

6

JEDEC

MO-203 Issue A

Millimeters

Inches

Notes

Min

Max

Min

Max

A

0.900

1.450

0.035

0.057

-

A1

0.000

0.150

0.000

0.006

-

A2

0.900

1.300

0.035

0.051

-

b

0.350

0.500

0.0138

0.0196

-

C

0.080

0.220

0.0031

0.009

-

D

2.800

3.000

0.11

0.118

3

E

2.600

3.000

0.102

0.118

-

E1

1.500

1.750

0.06

0.069

3

e

0.95 Ref

0.0374 Ref

-

e1

1.9 Ref

0.0748 Ref

-

L

0.100

0.600

0.004

0.023

4,5

N

66

6

a

0º

10º

0º

10º

-

M

2.590

0.102

-

O

0.690

.027 TYP

-

P

0.990

.039 TYP

-

R

0.950

0.038

-

O

P

R

M

Recommended Solder Pad Layout

2. Package conforms to EIAJ SC-74 (1992).

3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.

4. Footlenth L measured at reference to seating plane.

5. “L” is the length of flat foot surface for soldering to substrate.

exact.