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B32794D4355 Datasheet(PDF) 11 Page - EPCOS |
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B32794D4355 Datasheet(HTML) 11 Page - EPCOS |
11 / 19 page 1.3 General notes on soldering Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate- gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable coun- termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. EPCOS recommends the following conditions: Pre-heating with a maximum temperature of 110 °C Temperature inside the capacitor should not exceed the following limits: MKP/MFP 110 °C MKT 160 °C When SMD components are used together with leaded ones, the leaded film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled af- ter the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. Uncoated capacitors For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea- sures are recommended: pre-heating to not more than 110 °C in the preheater phase rapid cooling after soldering B32794 ... B32798 MKP AC filtering Preliminary Data Page 11 of 19 Please read Cautions and warnings and Important notes at the end of this document. |
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