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MAX6910EO30 Datasheet(PDF) 9 Page - Maxim Integrated Products |
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MAX6910EO30 Datasheet(HTML) 9 Page - Maxim Integrated Products |
9 / 33 page I2C-Compatible Real-Time Clocks with µP Supervisor and NV RAM Controller _______________________________________________________________________________________ 9 Detailed Description The MAX6909/MAX6910 contain eight 8-bit timekeeping registers, two burst address registers, a trickle charge register, a control register, a configuration register, an alarm configuration register, and seven alarm threshold registers, all controlled through a 2-wire serial interface. Figure 1 is the MAX6909/MAX6910 block diagram. The OUT pin supplies voltage for CMOS RAM or other ICs requiring the use of backup battery power. When VCC rises above the reset threshold (VRST) or above VBATT, OUT is connected to VCC. When VCC falls below VRST and VBATT, BATT is connected to OUT. If enabled, an on-board trickle charger charges BATT from VCC. BATT can act as a backup supply from either a battery or SuperCap™. When operating from BATT, the battery- on output (BATT ON) is pulled low and can be used as an indicator of operation in battery backup mode. There are two reset outputs, RESET and RESET. They become active while VCC is below the reset threshold (VRST) or while manual reset (MR) is held low, and for tRP after MR goes high, VCC rises above the reset threshold, or a WDI pulse is not received when the watchdog function is enabled. Reset thresholds are available for 3V and 3.3V applications. See the Ordering Information for specifics. MR is internally pulled high and contains debounce circuitry to accommodate a manual pushbutton reset switch. The WDI, when enabled, keeps RESET and RESET from becoming active if it is strobed once every tWDS or tWD. The watchdog timeout is selec- table in the configuration register. Other features include internal chip-enable gating logic, which accepts a valid CE IN from a microproces- sor and only gates it through as valid to CE OUT when the MAX6909/MAX6910 are not in a reset state. This can be used for disabling CMOS RAM to limit current consumption when OUT is switched to BATT. Pin Description PIN NAME FUNCTION 1 BATT Backup Battery Input. When VCC falls below the reset threshold and VBATT, OUT connects to BATT. Connect BATT to GND if no backup battery supply is used. 2 OUT Supply Output for CMOS RAM or Other ICs Requiring Use of Backup Battery Power. Bypass to GND with at least a 0.1µF capacitor. 3 BATT ON Logic Output Open Drain. BATT ON is low when the MAX6909/MAX6910 are powered from BATT. 4 CE IN Chip-Enable Input. Input to the chip-enable switch used for external RAM. Connect to VCC if unused. 5 PFI Power-Fail Comparator Input. For monitoring external power supplies. 6 MR Manual Reset Input. The active-low input has an internal pullup resistor. Internal debouncing circuitry ensures noise immunity. Leave open if unused. 7 WDI Watchdog Input 8 GND Ground 9X1 32.768kHz Crystal Pin; Oscillator Input 10 X2 32.768kHz Crystal Pin; Oscillator Output 11 CX FAIL Crystal Fail Output. Open drain, active low. 12 SDA Serial Data Line. Data input/output connection for the 2-wire serial interface. 13 SCL Serial Clock Line. Clock input connection for the 2-wire serial interface. 14 ALM Alarm Output. Open drain, active low. 15 PZT Piezo Transducer Output. Push-pull Piezo transducer output. 16 PFO Power-Fail Comparator Output. Push-pull active low. 17 CE OUT Chip-Enable Output. For controlling external RAM. 18 RESET Open-Drain, Active-Low Reset Output 19 RESET Push-Pull, Active-High Reset Output. Complement of RESET. 20 VCC Main Supply Input. Bypass to GND with at least a 0.01µF capacitor. SuperCap is a trademark of Baknor Industries. |
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