300mA LDO Linear Regulators with Internal

Microprocessor Reset Circuit

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7

MAX6469/MAX6470/MAX6477/MAX6478 Pin Description

PIN

BUMP

MAX6469/MAX6470

MAX6477/MAX6478

SOT23

TDFN

UCSP

NAME

FUNCTION

1

1, 2

A1

IN

Regulator Input. Bypass IN to GND with a 0.1µF capacitor.

2

3

A2

GND

Ground. This pin also functions as a heatsink. Solder to large pads or

the circuit-board ground plane to maximize thermal dissipation.

34

A3

SHDN

45

C3

RESET

reset threshold. RESET remains low for the duration of the reset timeout

period after the reset conditions are terminated. RESET is available in

open-drain and push-pull configurations.

5

6

C2

SET

Feedback Input for Externally Setting the Output Voltage. Connect SET

to GND to select the preset output voltage. Connect SET to an external

resistor-divider network for adjustable output operation.

6

7, 8

C1

OUT

Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR

capacitor.

—EP

—

—

Exposed Paddle. EP is internally connected to GND. Connect EP to the

ground plane to provide a low thermal-resistance path from the IC

junction to the PCB. Do not use as the electrical connection to GND.

MAX6471/MAX6472/MAX6479/MAX6480 Pin Description

PIN

BUMP

MAX6475/MAX6476

MAX6483/MAX6484

SOT23

TDFN

UCSP

NAME

FUNCTION

1

1, 2

A1

IN

Regulator Input. Bypass IN to GND with a 0.1µF capacitor.

23

A2

GND

Ground. This pin also functions as a heatsink. Solder to large pads or

the circuit-board ground plane to maximize thermal dissipation.

34

A3

SHDN

45

C3

RESET

Active-Low Reset Output. RESET remains low while FB is below the

reset threshold. RESET remains low for the duration of the reset timeout

period after the reset conditions are terminated. RESET is available in

open-drain and push-pull configurations.

5

6

C2

FB

Feedback Input for Linear Regulator Controller or Remote Sense

output voltage.

6

7, 8

C1

OUT

Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR

capacitor.

—EP

—

—

Exposed Paddle. EP is internally connected to GND. Connect EP to the

ground plane to provide a low thermal-resistance path from the IC

junction to the PCB. Do not use as the electrical connection to GND.