RX-P (ARXP1)

NOTES

2.54

.100

.035 dia. hole

0.9 dia. hole

2 coil latching only

0.90

.035

2.54

.100

7.62

.300

(2.74)

(.108)

(2.04)

(.080)

7.62

.300

2.63

.104

20.5

.807

2.54

.100

7-.016 to .018 dia.

7-0.40 to 0.45 dia.

2-.024

×.012

2-0.6

×0.3

Part No.

Lot No.

Solder to the

PC board earth.

12.4

.488

9.2

.362

3.0

.118

0.2

.008

External dimensions

Tolerance:

PC board pattern (Bottom view)

Tolerance:

Schematic (Bottom view)

+

-

(Reset condition)

(Reset condition)

(Deenergized condition)

2 coil latching

1 coil latching

Single side stable

+

7

RESET

SET

COM

+

-

6

1

8

9

10

11

12

13

14

RESET

SET

COM

-

+

7

1

8

9

10

11

12

13

14

NC

COM

NO

7

1

8

9

10

11

12

13

14

1. Coil operating power

Pure DC current should be applied to the

coil. The wave form should be

rectangular. If it includes ripple, the ripple

factor should be less than 5%.

However, check it with the actual circuit

since the characteristics may be slightly

different.

2. Coil connection

When connecting coils, refer to the wiring

diagram to prevent mis-operation or

malfunction.

To ensure accurate operation, the voltage

on both sides of the coil should be

±5%

(at 20

voltage.

Also, please note that the pick-up and

drop-out voltages (set and reset voltages)

will change depending on operation

temperature and conditions of use.

Keep the coil allowable voltage ripple

ratio to no more than 5%.

3. External magnetic field

Since RX-P relays are highly sensitive

polarized relays, their characteristics will

be affected by a strong external magnetic

field. Avoid using the relay under that

condition.

4. Cleaning

For automatic cleaning, the boiling

method is recommended. Avoid

ultrasonic cleaning which subjects the

relays to high frequency vibrations, which

may cause the contacts to stick.

It is recommended that alcoholic solvents

be used.

5. Soldering

1) Please meet the following conditions if

this relay is to be automatically soldered.

(1) Preheating: Max. 120

(terminal solder surface) for max. 120

seconds

(2) Soldering: Max. 260

for max. 6 seconds

2) Please meet the following conditions if

this relay is to be soldered by hand.

(1) 260

(2) 350

*In addition, when soldering the case to

the PC board, the plating may swell

depending on the soldering conditions.

6. Conditions for operation, transport

and storage conditions

1) Ambient temperature, humidity, and

atmospheric pressure during usage,

transport, and storage of the relay:

(1) Temperature:

–40 to +70

when 60 to 70

time is 1 second maximum and ON time

is 10% maximum.)

(2) Humidity: 5 to 85% RH

(Avoid freezing and condensation.)

The humidity range varies with the

temperature. Use within the range

indicated in the graph below.

(3) Atmospheric pressure: 86 to 106 kPa

Temperature and humidity range for

usage, transport, and storage:

2) Condensation

Condensation forms when there is a

sudden change in temperature under

high temperature and high humidity

conditions. Condensation will cause

deterioration of the relay insulation.

3) Freezing

Condensation or other moisture may

freeze on the relay when the temperature

is lower than 0

problems such as sticking of movable

parts or operational time lags.

4) Low temperature, low humidity

environments

The plastic becomes brittle if the relay is

exposed to a low temperature, low

humidity environment for long periods of

time.

Humidity, %R.H.

Temperature,

Tolerance range

85

5

070

-40

32

158

-40

(Avoid

condensation

when used at

temperatures

higher than

0

(Avoid freezing

when used at

temperatures

lower than

0

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