AXK(5/6)F

SPECIFICATIONS

1. Characteristics

2. Material and surface treatment

Item

Specifications

Conditions

Electrical

characteristics

Rated current

0.5A/contact (Max. 10 A at total contacts)

Rated voltage

60V AC/DC

Breakdown voltage

150V AC for 1 minute

Detection current: 1mA

Insulation resistance

Min. 1,000M

Ω (initial)

Using 500V DC megger

Contact resistance

Max. 90m

Ω

Based on the contact resistance measurement method specified by

JIS C 5402.

Mechanical

characteristics

Composite insertion force

Max. 0.981N/contacts

× contacts (initial)

Composite removal force

Min. 0.0588N/contacts

× contacts

Contact holding force

Min. 0.981N/contact

Measuring the maximum force.

As the contact is axially pull out.

Environmental

characteristics

Ambient temperature

–55

°C to +85°C

No freezing at low temperatures

Soldering heat resistance

Max. peak temperature of 260

°C (on the surface

of the PC board around the connector terminals)

Infrared reflow soldering

300

°C within 5 seconds, 350°C within 3 seconds Soldering iron

Storage temperature

–55

°C to +85°C (product only)

–40

°C to +50°C (emboss packing)

No freezing at low temperatures. No dew condensation.

Thermal shock resistance

(header and socket mated)

5 cycles,

insulation resistance min. 100M

Ω,

contact resistance max. 90m

Ω

Sequence

1. –55

°C, 30 minutes

2. ~ , Max. 5 minutes

3. 85

°C, 30 minutes

4. ~ , Max. 5 minutes

Humidity resistance

(header and socket mated)

120 hours, insulation resistance min. 100M

Ω,

contact resistance max. 90m

Ω

Bath temperature 40

±2°C, humidity 90 to 95% R.H.

Saltwater spray resistance

(header and socket mated)

24 hours,

insulation resistance min. 100M

Ω,

contact resistance max. 90m

Ω

Bath temperature 35

±2°C, saltwarter concentration 5±1%

(header and socket mated)

48 hours,

contact resistance max. 90m

Ω

Bath temperature 40

±2°C, gas concentration 3±1 ppm,

humidity 75 to 80% R.H.

Lifetime

characteristics

Insertion and removal life

50 times

Repeated insertion and removal speed of max. 200 times/hours

Unit weight

Mated height 1.5mm, 20 contacts; Socket: 0.06g

Header: 0.04g

Part name

Material

Surface treatment

Molded portion

LCP resin (UL94V-0)

—

Contact/Post

Copper alloy

Contact portion: Ni plating on base, Au plating on surface

Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)

The section close to the soldering portion has a nickel barrier.

(The nickel base is exposed.)

0

–3

+3

0

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