MC74HC259 datasheet(6/7 Pages) MOTOROLA

Part #	MC74HC259

Description	8-Bit Addressable Latch 1-of-8 Decoder

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Manufacturer	MOTOROLA [Motorola, Inc]

Direct Link	http://www.freescale.com

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6 / 7 page

MC54/74HC259

MOTOROLA

High–Speed CMOS Logic Data

DL129 — Rev 6

6

OUTLINE DIMENSIONS

J SUFFIX

CERAMIC PACKAGE

CASE 620–10

ISSUE V

N SUFFIX

PLASTIC PACKAGE

CASE 648–08

ISSUE R

19.05

6.10

—

0.39

1.40

0.21

3.18

19.93

7.49

5.08

0.50

1.65

0.38

4.31

0

°

0.51

15

°

1.01

1.27 BSC

2.54 BSC

7.62 BSC

MIN

MAX

INCHES

MILLIMETERS

DIM

0.750

0.240

—

0.015

0.055

0.008

0.125

0.785

0.295

0.200

0.020

0.065

0.015

0.170

0.050 BSC

0.100 BSC

0.300 BSC

A

B

C

D

E

F

G

J

K

L

M

N

0

°

0.020

15

°

0.040

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIM F MAY NARROW TO 0.76 (0.030) WHERE

THE LEAD ENTERS THE CERAMIC BODY.

1

8

9

16

–A

–

–B

–

C

K

N

G

E

F

D 16 PL

–T

–

SEATING

PLANE

M

L

J 16 PL

0.25 (0.010)

T

A

M

S

0.25 (0.010)

T

B

M

S

MIN

MAX

INCHES

MILLIMETERS

DIM

A

B

C

D

F

G

H

J

K

L

M

S

18.80

6.35

3.69

0.39

1.02

0.21

2.80

7.50

0

°

0.51

19.55

6.85

4.44

0.53

1.77

0.38

3.30

7.74

10

°

1.01

0.740

0.250

0.145

0.015

0.040

0.008

0.110

0.295

0

°

0.020

0.770

0.270

0.175

0.021

0.070

0.015

0.130

0.305

10

°

0.040

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

2.54 BSC

1.27 BSC

0.100 BSC

0.050 BSC

–A

–

B

1

8

9

16

F

H

G

D 16 PL

S

C

–T

–

SEATING

PLANE

K

J

M

L

T

A

0.25 (0.010) M

M

0.25 (0.010)

T

B

A

M

S

MIN

MAX

MILLIMETERS

INCHES

DIM

A

B

C

D

F

G

J

K

M

P

R

9.80

3.80

1.35

0.35

0.40

0.19

0.10

0

°

5.80

0.25

10.00

4.00

1.75

0.49

1.25

0.25

7

°

6.20

0.50

0.386

0.150

0.054

0.014

0.016

0.008

0.004

0

°

0.229

0.010

0.393

0.157

0.068

0.019

0.049

0.009

7

°

0.244

0.019

1.27 BSC

0.050 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

1

8

9

16

–A

–

–B

–

D 16 PL

K

C

G

–T

–

SEATING

PLANE

R X 45

°

M

J

F

P 8 PL

0.25 (0.010)

B

M

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B–05

ISSUE J

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