Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

3382 - 12 mm Rotary Position Sensor

Processing Information

Process Description

Materials

Temperature

Time Interval

1. Apply solder paste to test board

• Sn/Ag/Cu Alloy water

Room temperature

(8 - 10 mil thick)

soluble or no clean solder

paste

• Single sided epoxy glass

(G10) (UL approved)

• PC board approx. 4x4x.06 in.

2. Place test units onto board

6 units/board

3. Ramp up

Convection oven

2.5 °C ±0.5 °/second

4. Preheat

150 °C to 190 °C

90 ±30 seconds

5. Time above liquidus

220 °C

60-90 seconds

6. Peak temperature

260 °C +0 °/-5 °

10-20 sec. within 5 °C of peak

7. Ramp down

Room temperature

3 °C ±0.5 °C/second

300

255

220

190

150

0

0

50

100

150

TIME (SECONDS)

200

250