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313278-008 Datasheet(PDF) 5 Page - Intel Corporation |
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313278-008 Datasheet(HTML) 5 Page - Intel Corporation |
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5 / 118 page  Datasheet 5 Figures 1VCC Static and Transient Tolerance ............................................................................. 23 2VCC Overshoot Example Waveform ............................................................................. 24 3 Differential Clock Waveform ...................................................................................... 31 4 Differential Clock Crosspoint Specification ................................................................... 31 5 Differential Measurements......................................................................................... 31 6 Differential Clock Crosspoint Specification ................................................................... 32 7 Processor Package Assembly Sketch ........................................................................... 35 8 Processor Package Drawing Sheet 1 of 3 ..................................................................... 36 9 Processor Package Drawing Sheet 2 of 3 ..................................................................... 37 10 Processor Package Drawing Sheet 3 of 3 ..................................................................... 38 11 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processor E6000 Series with 4 MB L2 Cache with 1333 MHz FSB..................................... 40 12 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Series with 4 MB L2 Cache with 1066 MHz FSB ................................... 41 13 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E6000 Series with 2 MB L2 Cache ............................................................... 41 14 Processor Top-Side Markings Example for the Intel® Core™2 Duo Desktop Processors E4000 Series with 2 MB L2 Cache ............................................................... 42 15 Processor Top-Side Markings for the Intel® Core™2 Extreme Processor X6800 ................. 42 16 Processor Land Coordinates and Quadrants (Top View) ................................................. 43 17 land-out Diagram (Top View – Left Side) ..................................................................... 46 18 land-out Diagram (Top View – Right Side) ................................................................... 47 19 Thermal Profile 1 ..................................................................................................... 79 20 Thermal Profile 2 ..................................................................................................... 80 21 Thermal Profile 3 ..................................................................................................... 81 22 Thermal Profile 4 ..................................................................................................... 82 23 Thermal Profile 5 ..................................................................................................... 83 24 Case Temperature (TC) Measurement Location ............................................................ 84 25 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 86 26 Processor PECI Topology ........................................................................................... 90 27 Conceptual Fan Control on PECI-Based Platforms ......................................................... 91 28 Conceptual Fan Control on Thermal Diode-Based Platforms............................................ 91 29 Processor Low Power State Machine ........................................................................... 94 30 Mechanical Representation of the Boxed Processor ....................................................... 99 31 Space Requirements for the Boxed Processor (Side View)............................................ 100 32 Space Requirements for the Boxed Processor (Top View)............................................. 100 33 Space Requirements for the Boxed Processor (Overall View) ........................................ 101 34 Boxed Processor Fan Heatsink Power Cable Connector Description ................................ 102 35 Baseboard Power Header Placement Relative to Processor Socket ................................. 103 36 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................. 104 37 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................. 104 38 Boxed Processor Fan Heatsink Set Points................................................................... 106 39 Mechanical Representation of the Boxed Processor with a Type I TMA ........................... 109 40 Mechanical Representation of the Boxed Processor with a Type II TMA .......................... 110 41 Requirements for the Balanced Technology Extended (BTX) Type I Keep-out Volumes ............................................................................................................... 111 42 Requirements for the Balanced Technology Extended (BTX) Type II Keep-out Volume................................................................................................................. 112 43 Assembly Stack Including the Support and Retention Module ....................................... 113 44 Boxed Processor TMA Power Cable Connector Description ............................................ 114 45 Balanced Technology Extended (BTX) Mainboard Power Header Placement (hatched area) ...................................................................................................... 115 46 Boxed Processor TMA Set Points............................................................................... 117 |
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