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253666 Datasheet(PDF) 5 Page - Intel Corporation

Part # 253666
Description  Dual-Core Intel Xeon Processor
Download  104 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

253666 Datasheet(HTML) 5 Page - Intel Corporation

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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
5
8-1
Boxed Dual-Core Intel Xeon Processor 5000 Series 1U
Passive/2U Active Combination Heat Sink (With Removable Fan) ............................. 89
8-2
Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink.................. 90
8-3
2U Passive Dual-Core Intel Xeon Processor 5000 Series
Thermal Solution (Exploded View) ....................................................................... 90
8-4
Top Side Board Keep-Out Zones (Part 1) .............................................................. 92
8-5
Top Side Board Keep-Out Zones (Part 2) .............................................................. 93
8-6
Bottom Side Board Keep-Out Zones ..................................................................... 94
8-7
Board Mounting Hole Keep-Out Zones .................................................................. 95
8-8
Volumetric Height Keep-Ins ................................................................................ 96
8-9
4-Pin Fan Cable Connector (For Active CEK Heat Sink) ........................................... 97
8-10 4-Pin Base Board Fan Header (For Active CEK Heat Sink)........................................ 98
8-11 Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution ....................... 100
Tables
1-1
Dual-Core Intel® Xeon® Processor 5000 Series Features ....................................... 10
2-1
Core Frequency to FSB Multiplier Configuration ..................................................... 17
2-2
BSEL[2:0] Frequency Table ................................................................................ 17
2-3
Voltage Identification Definition........................................................................... 19
2-4
Loadline Selection Truth Table for LL_ID[1:0] ....................................................... 20
2-5
Market Segment Selection Truth Table for MS_ID[1:0] ........................................... 20
2-6
FSB Signal Groups............................................................................................. 22
2-7
Signal Description Table ..................................................................................... 23
2-8
Signal Reference Voltages .................................................................................. 23
2-9
Processor Absolute Maximum Ratings................................................................... 24
2-10 Voltage and Current Specifications....................................................................... 25
2-11 VCC Static and Transient Tolerance ..................................................................... 28
2-12 BSEL[2:0], VID[5:0] Signal Group DC Specifications .............................................. 30
2-13 AGTL+ Signal Group DC Specifications ................................................................. 30
2-14 PWRGOOD Input and TAP Signal Group DC Specifications ....................................... 30
2-15 GTL+ Asynchronous and AGTL+ Asynchronous Signal Group
DC Specifications .............................................................................................. 31
2-16 VTTPWRGD DC Specifications.............................................................................. 31
2-17 VCC Overshoot Specifications.............................................................................. 32
3-1
Package Loading Specifications ........................................................................... 37
3-2
Package Handling Guidelines............................................................................... 38
3-3
Processor Materials............................................................................................ 38
4-1
Land Listing by Land Name................................................................................. 43
4-2
Land Listing by Land Number .............................................................................. 52
5-1
Signal Definitions .............................................................................................. 61
6-1
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Specifications ........ 70
6-2
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile A Table ....... 71
6-3
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile B Table ....... 72
6-4
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Specifications .......... 72
6-5
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profile A Table ......... 73
6-6
Dual-Core Intel Xeon 5000 Series (667 MHz) Thermal Profile B Table ....................... 74
6-7
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Specifications ........................... 74
6-8
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table ............................. 75
6-9
Thermal Diode Parameters using Diode Model ....................................................... 80
6-10 Thermal Diode Interface..................................................................................... 81
6-11 Thermal Diode Parameters using Transistor Model ................................................. 81
6-12 Parameters for Tdiode Correction Factor ............................................................... 81


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