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440 Datasheet(PDF) 4 Page - Intel Corporation |
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440 Datasheet(HTML) 4 Page - Intel Corporation |
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4 / 100 page  4 Datasheet 5.2.2 Thermal Monitor 2 ..................................................................................79 5.2.3 On-Demand Mode...................................................................................80 5.2.4 PROCHOT# Signal ..................................................................................81 5.2.5 THERMTRIP# Signal ................................................................................81 5.3 Thermal Diode...................................................................................................82 5.4 Platform Environment Control Interface (PECI) ......................................................84 5.4.1 Introduction...........................................................................................84 5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management .......84 5.4.2 PECI Specifications .................................................................................86 5.4.2.1 PECI Device Address..................................................................86 5.4.2.2 PECI Command Support .............................................................86 5.4.2.3 PECI Fault Handling Requirements ...............................................86 5.4.2.4 PECI GetTemp0() Error Code Support ..........................................86 6Features ..................................................................................................................87 6.1 Power-On Configuration Options ..........................................................................87 6.2 Clock Control and Low Power States.....................................................................87 6.2.1 Normal State .........................................................................................88 6.2.2 HALT and Extended HALT Powerdown States ..............................................88 6.2.2.1 HALT Powerdown State ..............................................................88 6.2.2.2 Extended HALT Powerdown State ................................................89 6.2.3 Stop Grant State ....................................................................................89 6.2.4 HALT Snoop State and Stop Grant Snoop State...........................................90 7 Boxed Processor Specifications................................................................................91 7.1 Mechanical Specifications....................................................................................92 7.1.1 Boxed Processor Cooling Solution Dimensions.............................................92 7.1.2 Boxed Processor Fan Heatsink Weight .......................................................94 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....94 7.2 Electrical Requirements ......................................................................................94 7.2.1 Fan Heatsink Power Supply ......................................................................94 7.3 Thermal Specifications........................................................................................95 7.3.1 Boxed Processor Cooling Requirements......................................................95 7.3.2 Variable Speed Fan .................................................................................97 8 Debug Tools Specifications ......................................................................................99 8.1 Logic Analyzer Interface (LAI) .............................................................................99 8.1.1 Mechanical Considerations .......................................................................99 8.1.2 Electrical Considerations ..........................................................................99 |
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