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E6550 Datasheet(PDF) 4 Page - Intel Corporation

Part # E6550
Description  Core2 Extreme Processor
Download  122 Pages
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Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation

E6550 Datasheet(HTML) 4 Page - Intel Corporation

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Datasheet
5.2.5
THERMTRIP# Signal ................................................................................89
5.3
Thermal Diode...................................................................................................90
5.4
Platform Environment Control Interface (PECI) ......................................................92
5.4.1
Introduction...........................................................................................92
5.4.1.1
Key Difference with Legacy Diode-Based Thermal Management .......92
5.4.2
PECI Specifications .................................................................................94
5.4.2.1
PECI Device Address..................................................................94
5.4.2.2
PECI Command Support .............................................................94
5.4.2.3
PECI Fault Handling Requirements ...............................................94
5.4.2.4
PECI GetTemp0() Error Code Support ..........................................94
6Features ..................................................................................................................95
6.1
Power-On Configuration Options ..........................................................................95
6.2
Clock Control and Low Power States.....................................................................95
6.2.1
Normal State .........................................................................................96
6.2.2
HALT and Extended HALT Powerdown States ..............................................96
6.2.2.1
HALT Powerdown State ..............................................................96
6.2.2.2
Extended HALT Powerdown State ................................................97
6.2.3
Stop Grant and Extended Stop Grant States ...............................................97
6.2.3.1
Stop Grant State .......................................................................97
6.2.3.2
Extended Stop Grant State .........................................................98
6.2.4
Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop
State, and Stop Grant Snoop State ...........................................................98
6.2.4.1
HALT Snoop State, Stop Grant Snoop State ..................................98
6.2.4.2
Extended HALT Snoop State, Extended Stop Grant Snoop State.......98
6.3
Enhanced Intel® SpeedStep® Technology .............................................................98
7
Boxed Processor Specifications.............................................................................. 101
7.1
Mechanical Specifications.................................................................................. 102
7.1.1
Boxed Processor Cooling Solution Dimensions........................................... 102
7.1.2
Boxed Processor Fan Heatsink Weight ..................................................... 103
7.1.3
Boxed Processor Retention Mechanism and Heatsink Attach Clip
Assembly............................................................................................. 103
7.2
Electrical Requirements .................................................................................... 103
7.2.1
Fan Heatsink Power Supply .................................................................... 103
7.3
Thermal Specifications...................................................................................... 105
7.3.1
Boxed Processor Cooling Requirements.................................................... 105
7.3.2
Fan Speed Control Operation (Intel® Core2 Extreme Processor
X6800 Only) ........................................................................................ 107
7.3.3
Fan Speed Control Operation (Intel® Core2 Duo Desktop Processor
E6000 and E4000 Sequences Only) ......................................................... 107
8
Balanced Technology Extended (BTX) Boxed Processor Specifications ................... 111
8.1
Mechanical Specifications.................................................................................. 112
8.1.1
Balanced Technology Extended (BTX) Type I and Type II Boxed Processor
Cooling Solution Dimensions .................................................................. 112
8.1.2
Boxed Processor Thermal Module Assembly Weight ................................... 114
8.1.3
Boxed Processor Support and Retention Module (SRM) .............................. 115
8.2
Electrical Requirements .................................................................................... 116
8.2.1
Thermal Module Assembly Power Supply.................................................. 116
8.3
Thermal Specifications...................................................................................... 118
8.3.1
Boxed Processor Cooling Requirements.................................................... 118
8.3.2
Variable Speed Fan ............................................................................... 118
9
Debug Tools Specifications .................................................................................... 121
9.1
Logic Analyzer Interface (LAI) ........................................................................... 121
9.1.1
Mechanical Considerations ..................................................................... 121
9.1.2
Electrical Considerations ........................................................................ 121


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