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E6550 Datasheet(PDF) 4 Page - Intel Corporation |
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E6550 Datasheet(HTML) 4 Page - Intel Corporation |
4 / 122 page 4 Datasheet 5.2.5 THERMTRIP# Signal ................................................................................89 5.3 Thermal Diode...................................................................................................90 5.4 Platform Environment Control Interface (PECI) ......................................................92 5.4.1 Introduction...........................................................................................92 5.4.1.1 Key Difference with Legacy Diode-Based Thermal Management .......92 5.4.2 PECI Specifications .................................................................................94 5.4.2.1 PECI Device Address..................................................................94 5.4.2.2 PECI Command Support .............................................................94 5.4.2.3 PECI Fault Handling Requirements ...............................................94 5.4.2.4 PECI GetTemp0() Error Code Support ..........................................94 6Features ..................................................................................................................95 6.1 Power-On Configuration Options ..........................................................................95 6.2 Clock Control and Low Power States.....................................................................95 6.2.1 Normal State .........................................................................................96 6.2.2 HALT and Extended HALT Powerdown States ..............................................96 6.2.2.1 HALT Powerdown State ..............................................................96 6.2.2.2 Extended HALT Powerdown State ................................................97 6.2.3 Stop Grant and Extended Stop Grant States ...............................................97 6.2.3.1 Stop Grant State .......................................................................97 6.2.3.2 Extended Stop Grant State .........................................................98 6.2.4 Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State ...........................................................98 6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................98 6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......98 6.3 Enhanced Intel® SpeedStep® Technology .............................................................98 7 Boxed Processor Specifications.............................................................................. 101 7.1 Mechanical Specifications.................................................................................. 102 7.1.1 Boxed Processor Cooling Solution Dimensions........................................... 102 7.1.2 Boxed Processor Fan Heatsink Weight ..................................................... 103 7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly............................................................................................. 103 7.2 Electrical Requirements .................................................................................... 103 7.2.1 Fan Heatsink Power Supply .................................................................... 103 7.3 Thermal Specifications...................................................................................... 105 7.3.1 Boxed Processor Cooling Requirements.................................................... 105 7.3.2 Fan Speed Control Operation (Intel® Core2 Extreme Processor X6800 Only) ........................................................................................ 107 7.3.3 Fan Speed Control Operation (Intel® Core2 Duo Desktop Processor E6000 and E4000 Sequences Only) ......................................................... 107 8 Balanced Technology Extended (BTX) Boxed Processor Specifications ................... 111 8.1 Mechanical Specifications.................................................................................. 112 8.1.1 Balanced Technology Extended (BTX) Type I and Type II Boxed Processor Cooling Solution Dimensions .................................................................. 112 8.1.2 Boxed Processor Thermal Module Assembly Weight ................................... 114 8.1.3 Boxed Processor Support and Retention Module (SRM) .............................. 115 8.2 Electrical Requirements .................................................................................... 116 8.2.1 Thermal Module Assembly Power Supply.................................................. 116 8.3 Thermal Specifications...................................................................................... 118 8.3.1 Boxed Processor Cooling Requirements.................................................... 118 8.3.2 Variable Speed Fan ............................................................................... 118 9 Debug Tools Specifications .................................................................................... 121 9.1 Logic Analyzer Interface (LAI) ........................................................................... 121 9.1.1 Mechanical Considerations ..................................................................... 121 9.1.2 Electrical Considerations ........................................................................ 121 |
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