NZQA6V8AXV5T1 datasheet(1/5 Pages) ONSEMI

Part #	NZQA6V8AXV5T1

Description	Transient Voltage Suppressors ESD Protection Diode with Low Clamping Voltage

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Manufacturer	ONSEMI [ON Semiconductor]

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September, 2009 − Rev. 7

1

Publication Order Number:

NZQA5V6AXV5/D

NZQA5V6AXV5 Series

Transient Voltage Suppressors

ESD Protection Diode with Low Clamping

Voltage

This integrated transient voltage suppressor device (TVS) is

designed for applications requiring transient overvoltage protection. It

is intended for use in sensitive equipment such as computers, printers,

business machines, communication systems, medical equipment, and

other applications. Its integrated design provides very effective and

reliable protection for four separate lines using only one package.

These devices are ideal for situations where board space is at a premium.

Features

• Low Clamping Voltage

• Small SOT−553 SMT Package

• Stand Off Voltage: 3 V

• Low Leakage Current

• Four Separate Unidirectional Configurations for Protection

• ESD Protection: IEC61000−4−2: Level 4 ESD Protection

MILSTD 883C − Method 3015−6: Class 3

• Complies to USB 1.1 Low Speed & Full Speed Specifications

• These are Pb−Free Devices

Benefits

• Provides Protection for ESD Industry Standards: IEC 61000, HBM

• Protects Four Lines Against Transient Voltage Conditions

• Minimize Power Consumption of the System

• Minimize PCB Board Space

Typical Applications

• Instrumentation Equipment

• Serial and Parallel Ports

• Microprocessor Based Equipment

• Notebooks, Desktops, Servers

• Cellular and Portable Equipment

MAXIMUM RATINGS (TA = 25°C unless otherwise noted)

Characteristic

Symbol

Value

Unit

Peak Power Dissipation (Note 1)

PPK

20

W

Steady State Power − 1 Diode (Note 2)

PD

380

mW

Thermal Resistance,

Junction−to−Ambient

Above 25°C, Derate

RqJA

327

3.05

°C/W

mW/°C

Maximum Junction Temperature

TJmax

150

°C

Operating Junction and Storage

Temperature Range

TJ Tstg

−55 to

+150

°C

Lead Solder Temperature (10 seconds

duration)

TL

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Non−repetitive current per Figure 5.

2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%.

Mounted on FR−4 board with min pad.

See Application Note AND8308/D for further description of

survivability specs.

SOT−553*

SOT−553

CASE 463B

PLASTIC

5

4

1

2

3

MARKING DIAGRAM

http://onsemi.com

Device

Package

Shipping†

ORDERING INFORMATION

NZQA5V6AXV5T1

SOT−553* 4000/Tape & Reel

NZQA6V8AXV5T1

SOT−553* 4000/Tape & Reel

NZQA6V8AXV5T3

16000/Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

xx M G

G

xx

= Device Code

M

= Date Code*

G

= Pb−Free Package

(Note: Microdot may be in either location)

SOT−553*

NZQA5V6AXV5T1G SOT−553* 4000/Tape & Reel

NZQA6V8AXV5T1G SOT−553* 4000/Tape & Reel

NZQA6V8AXV5T3G

16000/Tape & Reel

*This package is inherently Pb−Free.

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