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NZQA6V8AXV5T1 Datasheet(PDF) 1 Page - ON Semiconductor |
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NZQA6V8AXV5T1 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 5 page © Semiconductor Components Industries, LLC, 2009 September, 2009 − Rev. 7 1 Publication Order Number: NZQA5V6AXV5/D NZQA5V6AXV5 Series Transient Voltage Suppressors ESD Protection Diode with Low Clamping Voltage This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its integrated design provides very effective and reliable protection for four separate lines using only one package. These devices are ideal for situations where board space is at a premium. Features • Low Clamping Voltage • Small SOT−553 SMT Package • Stand Off Voltage: 3 V • Low Leakage Current • Four Separate Unidirectional Configurations for Protection • ESD Protection: IEC61000−4−2: Level 4 ESD Protection MILSTD 883C − Method 3015−6: Class 3 • Complies to USB 1.1 Low Speed & Full Speed Specifications • These are Pb−Free Devices Benefits • Provides Protection for ESD Industry Standards: IEC 61000, HBM • Protects Four Lines Against Transient Voltage Conditions • Minimize Power Consumption of the System • Minimize PCB Board Space Typical Applications • Instrumentation Equipment • Serial and Parallel Ports • Microprocessor Based Equipment • Notebooks, Desktops, Servers • Cellular and Portable Equipment MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Peak Power Dissipation (Note 1) PPK 20 W Steady State Power − 1 Diode (Note 2) PD 380 mW Thermal Resistance, Junction−to−Ambient Above 25°C, Derate RqJA 327 3.05 °C/W mW/°C Maximum Junction Temperature TJmax 150 °C Operating Junction and Storage Temperature Range TJ Tstg −55 to +150 °C Lead Solder Temperature (10 seconds duration) TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non−repetitive current per Figure 5. 2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR−4 board with min pad. See Application Note AND8308/D for further description of survivability specs. SOT−553* SOT−553 CASE 463B PLASTIC 5 4 1 2 3 MARKING DIAGRAM http://onsemi.com Device Package Shipping† ORDERING INFORMATION NZQA5V6AXV5T1 SOT−553* 4000/Tape & Reel NZQA6V8AXV5T1 SOT−553* 4000/Tape & Reel NZQA6V8AXV5T3 16000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. xx M G G xx = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) SOT−553* NZQA5V6AXV5T1G SOT−553* 4000/Tape & Reel NZQA6V8AXV5T1G SOT−553* 4000/Tape & Reel NZQA6V8AXV5T3G 16000/Tape & Reel *This package is inherently Pb−Free. |
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