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CY7C1911JV18-250BZI Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1911JV18-250BZI
Description  18-Mbit QDR II SRAM 4-Word Burst Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1911JV18-250BZI Datasheet(HTML) 1 Page - Cypress Semiconductor

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18-Mbit QDR® II SRAM 4-Word
Burst Architecture
CY7C1311JV18/CY7C1911JV18
CY7C1313JV18/CY7C1315JV18
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document Number: 001-12562 Rev. *D
Revised August 04, 2009
Features
Separate Independent Read and Write Data Ports
Supports concurrent transactions
300 MHz Clock for High Bandwidth
4-word Burst for reducing Address Bus Frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two Input Clocks (K and K) for Precise DDR Timing
SRAM uses rising edges only
Two Input Clocks for Output Data (C and C) to minimize Clock
Skew and Flight Time mismatches
Echo Clocks (CQ and CQ) simplify Data Capture in High Speed
Systems
Single Multiplexed Address Input Bus latches Address Inputs
for both Read and Write Ports
Separate Port Selects for Depth Expansion
Synchronous Internally Self-timed Writes
QDR
® II Operates with 1.5 Cycle Read Latency when the Delay
Lock Loop (DLL) is enabled
Operates like a QDR I device with 1 Cycle Read Latency in
DLL Off Mode
Available in x8, x9, x18, and x36 configurations
Full Data Coherency, providing most current Data
Core VDD = 1.8 (±0.1V); IO VDDQ = 1.4V to VDD
Available in 165-Ball FBGA Package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable Drive HSTL Output Buffers
JTAG 1149.1 Compatible Test Access Port
Delay Lock Loop (DLL) for Accurate Data Placement
Configurations
CY7C1311JV18 – 2M x 8
CY7C1911JV18 – 2M x 9
CY7C1313JV18 – 1M x 18
CY7C1315JV18 – 512K x 36
Functional Description
The CY7C1311JV18, CY7C1911JV18, CY7C1313JV18, and
CY7C1315JV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR II architecture. QDR II architecture consists
of two separate ports: the read port and the write port to access
the memory array. The read port has dedicated data outputs to
support read operations and the write port has dedicated data
inputs to support write operations. QDR II architecture has
separate data inputs and data outputs to eliminate the need to
‘turnaround’ the data bus required with common IO devices.
Access to each port is accomplished through a common address
bus. Addresses for read and write addresses are latched on
alternate rising edges of the input (K) clock. Accesses to the
QDR II read and write ports are completely independent of one
another. In order to maximize data throughput, both read and
write ports are provided with DDR interfaces. Each address
location is associated with four 8-bit words (CY7C1311JV18) or
9-bit words (CY7C1911JV18) or 18-bit words (CY7C1313JV18)
or 36-bit words (CY7C1315JV18) that burst sequentially into or
out of the device. Because data is transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus ‘turnarounds’.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
Description
300 MHz
250 MHz
Unit
Maximum Operating Frequency
300
250
MHz
Maximum Operating Current
x8
730
665
mA
x9
735
675
x18
790
705
x36
895
830
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