CY62167EV30LL-45ZXI datasheet(2/14 Pages) CYPRESS

Part #	CY62167EV30LL-45ZXI

Description	16-Mbit (1M x 16 / 2M x 8) Static RAM

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Manufacturer	CYPRESS [Cypress Semiconductor]

Direct Link	http://www.cypress.com

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CY62167EV30 MoBL®

Document #: 38-05446 Rev. *F

Page 2 of 14

Pin Configuration

Figure 1. 48-Ball VFBGA (6 x 7 x 1mm) / (6 x 8 x 1mm) Top View [1, 2, 3]

Figure 2. 48-Pin TSOP I Top View [3, 4]

Product Portfolio

Product

Range

VCC Range (V)

Speed

(ns)

Power Dissipation

Operating ICC (mA)

Standby ISB2

(

μA)

f = 1 MHz

f = fmax

Min

Typ[5]

Max

Typ[5]

Max

Typ[5]

Max

Typ[5]

Max

CY62167EV30LL

Industrial/Auto-A

2.2

3.0

3.6

45

2.2

4.0

25

30

1.5

12

WE

A11

A10

A6

A0

CE1

I/O10

I/O8

I/O9

A4

A5

I/O11

I/O13

I/O12

I/O14

I/O15

VSS

A9

A8

OE

Vss

A7

I/O0

BHE

CE2

A17

BLE

VCC

I/O2

I/O1

I/O3

I/O4

I/O5

I/O6

I/O7

A15

A14

A13

A

12

A19

A18

NC

3

2

6

5

4

1

D

E

B

A

C

F

G

H

A16

NC

VCC

A1

A2

A3

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

32

31

30

29

28

27

26

25

A15

A14

A13

A12

A11

A10

A9

A8

A19

NC

WE

CE2

NC

BHE

BLE

A18

A17

A7

A6

A5

A4

A3

A2

A1

A16

BYTE

Vss

IO15/A20

IO7

IO14

IO6

IO13

IO5

IO12

IO4

Vcc

IO11

IO3

IO10

IO2

IO9

IO1

IO8

IO0

OE

Vss

CE1

A0

Notes

1. The information related to 6 x 7 x 1 mm VFBGA package is preliminary.

2. Ball H6 for the VFBGA package can be used to upgrade to a 32M density.

3. NC pins are not connected on the die.

4. The BYTE pin in the 48-TSOPI package has to be tied to VCC to use the device as a 1M X 16 SRAM. The 48-TSOPI package can also be used as a 2M X 8 SRAM

by tying the BYTE signal to VSS. In the 2M x 8 configuration, Pin 45 is A20, while BHE, BLE and IO8 to IO14 pins are not used.

5. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ), TA = 25°C.

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