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S5000XAL Datasheet(PDF) 11 Page - Intel Corporation |
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S5000XAL Datasheet(HTML) 11 Page - Intel Corporation |
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11 / 112 page  Introduction Intel ® Server Board S5000PAL / S5000XAL TPS Revision 1.7 Intel order number: D31979-010 12 1. Introduction This Technical Product Specification (TPS) provides board specific information detailing the features, functionality, and high level architecture of the Intel® Server Board S5000PAL and Intel ® Server Board S5000XAL. The Intel ® S5000 Series Chipsets Server Board Family Datasheet should also be referenced for more in depth detail of various board sub-systems including chipset, BIOS, System Management, and System Management software. In addition, design level information for specific sub-systems can be obtained by ordering the External Product Specifications (EPS) or External Design Specifications (EDS) for a given sub-system. EPS and EDS documents are not publicly available. They are only made available under NDA with Intel and must be ordered through your local Intel representative. The Intel® Server Board S5000PAL/XAL may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Refer to the Intel® Server Board S5000PAL/XAL Specification Update for published errata. 1.1 Chapter Outline This document is divided into the following chapters • Chapter 1 – Introduction • Chapter 2 – Server Board Overview • Chapter 3 – Functional Architecture • Chapter 4 – Platform Management • Chapter 5 – Connector & Header Location and Pin-out • Chapter 6 – Configuration Jumpers • Chapter 7 – Light Guided Diagnostics • Chapter 8 – Power and Environmental Specifications • Chapter 9 – Regulatory and Certification Information • Appendix A – Integration and Usage Tips • Appendix B – BMC Sensor Tables • Appendix C – POST Code Diagnostic LED Decoder • Appendix D – Post Code Errors • Appendix E – Supported Intel ® Server Chassis 1.2 Server Board Use Disclaimer Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non- operating limits. |
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