Dual 300mA Pin-Programmable LDO

Linear Regulators

6

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Pin Description

PIN

MAX8633

MAX8634

MAX8635

MAX8636

NAME

FUNCTION

11

11

IN

Regulator Input. Supply voltage from 2.7V to 5.5V.

Bypass IN with a ceramic capacitor of at least 2.2µF to

GND (see the Capacitor Selection and Regulator

Stability section).

2—

—

2

SHDN

Shutdown Input, Active Low. Drive SHDN logic low to

shut down both regulators. Connect SHDN to IN or drive

logic high for normal operation (see the Power-On

Sequence (MAX8633/Max8636 Only) section).

—2

2

—

SHDN1

LDO1 Shutdown Input, Active Low. Drive SHDN1 logic

low to shut down OUT1. Connect SHDN1 to IN or drive

logic high for normal operation.

—3

5

—

SHDN2

LDO2 Shutdown Input, Active Low. Drive SHDN2 logic

low to shut down OUT2. Connect SHDN2 to IN or drive

logic high for normal operation.

3—

3

3

P2

Programming Input 2. The state of P1 and P2 selects

one of nine output-voltage options (see Tables 1, 3).

4—

4

4

P1

Programming Input 1. The state of P1 and P2 selects

one of nine output-voltage options (see Tables 1, 3).

—4

——

—

P

Programming Input. The state of P selects one of three

output-voltage options for the MAX8634 (see Table 2).

5—

—

—

RESET

Reset Output, Active Low, Open Drain. RESET goes high

the nominal output voltage. RESET is forced logic low

voltage. Connect RESET to OUT1, OUT2, or another

—5—5

BP

Reference Noise Bypass. Bypass BP to GND with a

0.01µF ceramic capacitor to reduce output noise.

6

6

6

6

GND

Ground

7

7

7

7

OUT2

Regulator 2 Output. Guaranteed 300mA output current

(see the Calculating Maximum Output Power section).

Bypass OUT2 with a ceramic capacitor of at least 2.2µF

to GND (see the Capacitor Selection and Regulator

Stability section).

8

8

8

8

OUT1

Regulator 1 Output. Guaranteed 300mA output current

(see the Calculating Maximum Output Power section).

Bypass OUT1 with a ceramic capacitor of at least 2.2µF

to GND (see the Capacitor Selection and Regulator

Stability section).

EP*

EP*

EP*

EP*

EP

Exposed Paddle. Solder the exposed paddle to a large

pad or circuit-board ground plane to increase thermal

dissipation.

*

TDFN package only.