BGF112

AV I/F Device with ESD Protection

BGF112

Data Sheet

7

V3.0, 2008-11-19

Package Outlines

Figure 4

WLP-5-1 (dimensions in mm)

Tape and reel specification

Figure 5

Tape for WLP-5-1 (dimensions in mm)

You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”:

http://www.infineon.com/products

Corner Index Area

Pin 1

2)

COPLANARITY

0.6

0.08

5x

C

C

STANDOFF

±0.05

0.2

±0.05

0.1 C

A1

A2

B2 C2

C1

0.4

±0.05

0.76

±0.05

(0.18

)

±0.05

(0.18

)

B

A

A

5x

0.25

B

±0.04

1)

3) Primary datum C and seating plane are defined by the domed crowns of the balls

1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C

2) A1 corner identified by marking

WLP-5-1-N-PO V02

Solder balls face down

Solder balls face up

WLP-5-1-N-TP V01

Pin 1

Corner Index Area

0.87

0.25

0.71

4