Data Sheet

6

Rev. 1.02, 2010-05-20

IFX25001

General Product Characteristics

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

PG-TO252-3

4.3.1

1) Not subject to production test, specified by design.

R

thJC

–

4

–

K/W

measured to heat

slug

4.3.2

Junction to Ambient1)

R

thJA

–27

–

K/W

2)

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

4.3.3

R

thJA

–

57

–

K/W

300 mm² heatsink

3) Specified

R

(Chip+Package) was simulated on a 76.2

4.3.4

R

thJA

–

42

–

K/W

600 mm² heatsink

area3)

PG-TO263-3

4.3.5

Junction to Case1)

R

thJC

–

4

–

K/W

measured to heat

slug

4.3.6

Junction to Ambient1)

R

thJA

–22

–

K/W

2)

4.3.7

R

thJA

–

42

–

K/W

300 mm² heatsink

area3)

4.3.8

R

thJA

–

33

–

K/W

600 mm² heatsink

area3)

PG-TO220-3

4.3.9

R

thJC

–

8

–

K/W

measured to

exposed pad

PG-SOT223-4

4.3.10

R

thJC

–

25

–

K/W

measured to heat

slug

4.3.11

Junction to Ambient1)

R

thJA

–51

–

K/W

2)

4.3.12

R

thJA

–

75

–

K/W

300 mm² heatsink

area3)

4.3.13

R

thJA

–

63

–

K/W

600 mm² heatsink

area3)