Data Sheet

6

Rev. 1.01, 2009-10-19

IFX27001

General Product Characteristics

4.2

Functional Range

Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the Electrical Characteristics table.

4.3

Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Pos.

Parameter

Symbol

Limit Values

Unit Remarks

Min.

Max.

4.2.1

Input voltage

V

I

V

40

V

4.2.2

Junction temperature

T

j

-40

125

°C–

Pos.

Parameter

Symbol

Limit Values

Unit

Conditions

Min.

Typ.

Max.

PG-TO252-3

4.3.1

1) Not subject to production test, specified by design.

R

thJC

–

4

–

K/W

measured to heat

slug

4.3.2

Junction to Ambient1)

R

thJA

–27

–

K/W

2)

2) Specified

R

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

4.3.3

R

thJA

–

57

–

K/W

300 mm² heatsink

3) Specified

R

(Chip+Package) was simulated on a 76.2

4.3.4

R

thJA

–

42

–

K/W

600 mm² heatsink

area3)