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BGF106C Datasheet(PDF) 7 Page - Infineon Technologies AG |
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BGF106C Datasheet(HTML) 7 Page - Infineon Technologies AG |
7 / 7 page BGF106C SIM Card Interface Filter and ESD Protection BGF106C Data Sheet 7 V2.0, 2009-04-14 Package Outlines Figure 4 WLP-8-11 (Wafer Level Package) Footprint Figure 5 Recommended PCB pad design for reflow soldering Tape Figure 6 Tape for BGF106C / WLP-8-11 You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. 2) COPLANARITY 0.6 0.08 8x C C STANDOFF ±0.05 0.2 ±0.05 0.1 C 0.4 ±0.05 1.2 B A A 8x ø0.05 M 0.25 B ±0.04 1) 3) Primary datum C and seating plane are defined by the domed crowns of the balls 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) A1 corner identified by marking WLP-8-11-N-PO V01 2 x 0.4 = 0.8 A3 A2 B3 C3 B2 B1 C2 C1 (0.2 ) ±0.05 (0.2 ) ±0.05 Pin A1 Corner Index Area Solder balls face down Solder balls face up WLP-8-11-N-FP V01 0.4 0.8 0.25 WLP-8-11-N-TP V01 Pin A1 Corner Index Area 1.33 ±0.05 0.25 0.75 ±0.1 4 |
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