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IPU039N03LG Datasheet(PDF) 2 Page - Infineon Technologies AG

Part # IPU039N03LG
Description  OptiMOS짰3 Power-Transistor Features Fast switching MOSFET for SMPS
Download  10 Pages
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Manufacturer  INFINEON [Infineon Technologies AG]
Direct Link  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

IPU039N03LG Datasheet(HTML) 2 Page - Infineon Technologies AG

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IPF039N03L G
IPU039N03L G
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Unit
Power dissipation
P tot
T C=25 °C
94
W
Operating and storage temperature
T j, T stg
-55 ... 175
°C
IEC climatic category; DIN IEC 68-1
55/175/56
Parameter
Symbol Conditions
Unit
min.
typ.
max.
Thermal characteristics
Thermal resistance, junction - case
R thJC
-
-
1.6
K/W
SMD version, device on PCB
R thJA
minimal footprint
-
-
75
6 cm² cooling area
4)
--
50
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
30
-
-
V
Gate threshold voltage
V GS(th)
V DS=V GS, I D=250 µA
1
-
2.2
Zero gate voltage drain current
I DSS
V DS=30 V, V GS=0 V,
T j=25 °C
-
0.1
1
µA
V DS=30 V, V GS=0 V,
T j=125 °C
-
10
100
Gate-source leakage current
I GSS
V GS=20 V, V DS=0 V
-
10
100
nA
R DS(on)
V GS=4.5 V, I D=30 A
-
4.2
5.2
m
V GS=10 V, I D=30 A
-
3.3
3.9
Gate resistance
R G
-
1.6
-
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=30 A
48
96
-
S
Value
Values
2) See figure 3 for more detailed information
Drain-source on-state resistance
5)
4) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
5) Measured from drain tab to source pin
3) See figure 13 for more detailed information
Rev. 0.9 target datasheet
page 2
2006-10-23


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