SIDC73D170E6

Edited by INFINEON Technologies, AIM PMD D CID CLS, L4381N, Edition 1.2, 28.0 7.2008

Fast switching diode chip in Emitter Controlled -Technology

This chip is used for:

•

power modules and discrete

devices

Features:

•

1700V technology, Emitter Controlled

•

soft, fast switching

•

low reverse recovery charge

•

small temperature coefficient

Applications:

•

SMPS, resonant applications,

drives

A

C

Chip Type

Die Size

Package

SIDC73 D170E6

1700V

100A

8.53 x 8.53 mm

2

sawn on foil

Mechanical Parameter

Raster size

8.53 x 8.53

Area total

72.76

Anode pad size

6.51 x 6.51

mm

2

Thickness

200

µm

Wafer size

150

mm

Max. possible chips per wafer

189

Passivation frontside

Photoimide

Pad metal

3200 nm AlSiCu

Backside metal

Ni Ag –system

suitable for epoxy and soft solder die bonding

Die bond

Electrically conductive glue or solder

Wire bond

Al,

≤500µm

Reject ink dot size

∅ 0.65mm; max 1.2mm

Recommended storage environment

Store in original container, in dry nitrogen,in dark

environment, < 6 month at an ambient temperature of 23°C