MPXC12DT1

Rev 0, 11/2010

Freescale Semiconductor

© Freescale Semiconductor, Inc., 2010. All rights reserved.

Pressure

10 kPa Uncompensated Silicon

Pressure Sensor

Freescale Semiconductor has developed a low cost, high volume, miniature

pressure sensor package which is ideal as a sub-module component or a

disposable unit. The unique concept of the Chip Pak allows great flexibility in

system design while allowing an economic solution for the designer.This

standard, low cost, uncompensated sensor permits manufacturers to design

and add their own external temperature compensating and signal conditioning

networks. Compensation techniques are simplified because of Freescale’s

single element strain gauge design.

Features

• Low Cost

• Ratiometric to Supply Voltage

• Polysulfone Case Material (ISO 10993)

• Provided in Easy-to-Use Tape and Reel

• Patented Silicon Shear Stress Strain Gauge Design

NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).

Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices

during all processes.

ORDERING INFORMATION

Device Name

Package Options

Case No.

Pressure Type

Device Marking

Gauge

Differential

Absolute

MPXC12DTI

Tape and Reel

423A

•

Date Code, Lot ID

MPXC12DT1

Pressure Sensor

55 mV Full Scale Span (Typical)

0 to 10 kPa

CHIP PAK PACKAGE

MPXC12DT1

CASE 423A

Application Examples

• Respiratory Diagnostics