IP4283CZ10_1

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 01 — 7 May 2009

7 of 10

NXP Semiconductors

IP4283CZ10

ESD protection for ultra high-speed interfaces

Fig 4.

Package outline SOT552-1 (TSSOP10)

UNIT

A1

A

max.

A2

A3

bp

L

HE

Lp

wy

v

ce

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.15

0.05

0.95

0.80

0.30

0.15

0.23

0.15

3.1

2.9

3.1

2.9

0.5

5.0

4.8

0.67

0.34

6

°

0

°

0.1

0.1

0.1

0.95

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.4

SOT552-1

99-07-29

03-02-18

bp

D

Z

e

0.25

15

10

6

θ

A

A2

A1

Lp

(A3)

detail X

L

HE

E

c

X

A

y

2.5

5 mm

0

scale

TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm

SOT552-1

1.1

pin 1 index