Data Sheet D19796EJ1V0DS

9

NP80N055MDG, NP80N055NDG, NP80N055PDG

TAPE INFORMATION (NP80N055PDG)

There are two types (-E1B, -E2B) of taping depending on the direction of the device.

Reel side

Draw-out side

−E1B TYPE

−E2B TYPE

MARKING INFORMATION

80N055

Lot code

NEC

DG

Pb-free plating marking

Abbreviation of part number

RECOMMENDED SOLDERING CONDITIONS

These products should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, please contact an NEC Electronics

sales representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

NP80N055PDG

Maximum temperature (Package's surface temperature): 260

°C or below

Time at maximum temperature: 10 seconds or less

Time of temperature higher than 220

°C: 60 seconds or less

Preheating time at 160 to 180

°C: 60 to 120 seconds

Maximum number of reflow processes: 3 times

Maximum chlorine content of rosin flux (percentage mass): 0.2% or less

IR60-00-3

Wave soldering

NP80N055MDG,

NP80N055NDG

Maximum temperature (Solder temperature): 260

°C or below

Time: 10 seconds or less

Maximum chlorine content of rosin flux: 0.2% (wt.) or less

THDWS

Partial heating

NP80N055MDG,

NP80N055NDG,

NP80N055PDG

Maximum temperature (Pin temperature): 350

°C or below

Time (per side of the device): 3 seconds or less

Maximum chlorine content of rosin flux: 0.2% (wt.) or less

P350

Caution Do not use different soldering methods together (except for partial heating).