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RU82566DC Datasheet(PDF) 1 Page - Intel Corporation |
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RU82566DC Datasheet(HTML) 1 Page - Intel Corporation |
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1 / 30 page  82566 Gigabit Platform LAN Connect Networking Silicon Datasheet Product Features ■ IEEE 802.3ab compliant — Robust operation over the installed base of Category-5 (Cat-5) twisted pair cabling ■ Robust end to end connections over various cable lengths ■ Full duplex at 10, 100, or 1000 Mbps and half duplex at 10 or 100 Mbps. ■ IEEE 802.3ab Auto-negotiation with Next Page support — Automatic link configuration including speed, duplex, and flow control ■ 10/100 downshift — Automatic link speed adjustment with poor quality cable ■ Automatic MDI crossover — Helps to correct for infrastructure issues ■ Advanced Cable Diagnostics — Improved end-user troubleshooting ■ Footprint compatible with 82562V devices for a single-board dual design (Gigabit and 10/100) ■ LCI interface for a very low power 10/100 link ■ Gigabit LAN Connect Interface — Low pin count, high speed interface with special low power idle modes — Allows PHY placement proximity to I/O back panel. ■ 3 LED outputs — Link and Activity indications (10, 100, and 1000 Mbps) ■ Clock supplied to MAC — Cost optimized design ■ Full chip power down — Support for lowest power state ■ 81-pin, 1.0 mm pitch, 10 mm x 10 mm FCMMAP (BGA) Package — Smaller footprint and lower power dissipation compared to multi-chip MAC and PHY solutions. Footprint compatible with the Intel ® 82562V Platform LAN Connect device ■ Integrated voltage regulator and power supply control, which can be powered from a single 3.3V DC rail ■ Operating temperatures: 0° C to 70° C and 0° C to 55° C (with internal regulator) – heat sink or forced airflow not required — Simple Thermal Design ■ Power Consumption less than 1.16 Watts (silicon power) 317436-003 Revision 2.4 |
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