iC-JX

16-FOLD 24 V HIGH-SIDE DRIVER WITH µC INTERFACE

Rev C1, Page 4/36

ABSOLUTE MAXIMUM RATINGS

Beyond these values damage may occur; device operation is not guaranteed. Absolute Maximum Ratings are no Operating Conditions.

Integrated circuits with system interfaces, e.g. via cable accessible pins (I/O pins, line drivers) are per principle endangered by injected

interferences, which may compromise the function or durability. The robustness of the devices has to be verified by the user during system

development with regards to applying standards and ensured where necessary by additional protective circuitry. By the manufacturer

suggested protective circuitry is for information only and given without responsibility and has to be verified within the actual system with

respect to actual interferences.

(Legend: x = 1..16, y = 1..4)

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Max.

G001 VCC, VDD Supply Voltage

-0.3

6

V

G002 VBy

Driver Supply Voltage

-0.3

40

V

G003 V(IOx)

Voltages at IO1...16

-10

40

V

G004 Idc(IOx)

Current in IO1...16

see Figure 1

-500

150

mA

G005 Ipk(IOx)

Pulse current in IO1...16

IOx = hi, τ = 2 ms, T ≤ 2 s

see Figure 2

-1.0

A

G006 Imax()

Current in VCC, VDD

-100

100

mA

G007 Imax(VBy) Current in VB1...4

-8

8

A

G008 Ic()

Current in NCS, NWR, NRD, A0...4,

D0...7, NRES, CLK, BLFQ, POE, NSP,

RSET, VREF

D0...7 with input function

-20

20

mA

G009 I()

Current in D0...7, NINT,

D0...7 with output function

-25

25

mA

G010 Ilu()

Pulse current in NCS, NWR, NRD,

A0...4, D0...7, NRES, CLK, BLFQ,

NINT, NSP, POE, IO1...16, RSET,

VREF (latch up test)

Pulse width < 10 µs,

all inputs / outputs open

-100

100

mA

G011 Vd()

ESD-voltage, all pins

HBM 100 pF discharged over 1.5 kΩ

2

kV

G012 Vb()

Burst transients at IO1...16

after IEC 1000-4-4

4

kV

G013 Tj

Chip temperature

-40

150

°C

G014 Ts

Storage temperature

-40

150

°C

additional diodes or sufficient current limiting ohmic resistors have to be connected in series to the IO-pins to

prevent reverse back biasing of the device.

THERMAL DATA

Operating conditions: VCC = VDD = 3 ... 5.5 V, VBy = 12 ... 36 V, GNDA = GNDD = 0 V, all inputs on defined logic states (high or low)

Item

Symbol

Parameter

Conditions

Unit

No.

Min.

Typ.

Max.

T01

Ta

Ambient temperature

extended temperature range on request

-40

85

°C

T02

Rthja

Thermal resistance chip/ambient

package mounted on PCB

55

K/W

All voltages are referenced to ground unless otherwise stated.

All currents flowing into the device pins are positive; all currents flowing out of the device pins are negative.