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AP2281 Datasheet(PDF) 9 Page - Diodes Incorporated |
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AP2281 Datasheet(HTML) 9 Page - Diodes Incorporated |
9 / 13 page AP2281 Single Slew Rate Programmable Load Switch AP2281 Rev. 4 9 of 13 FEBRUARY 2009 www.diodes.com © Diodes Incorporated Input Capacitor A 1 μF capacitor is recommended to connect between IN and GND pins to decouple input power supply glitch and noise. The input capacitor has no specific type or ESR (Equivalent Series Resistance) requirement. However, for higher current application, ceramic capacitors are recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications. This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is required for both IN and GND. Output Capacitor A 0.1 μF capacitor is recommended to connect between OUT and GND pins to stabilize and accommodate load transient condition. The output capacitor has no specific type or ESR requirement. The amount of the capacitance may be increased without limit. For PCB layout, the output capacitor must be placed as close as possible to OUT and GND pins, and keep the traces as short as possible. ENABLE/SHUTDOWN Operation The AP2281 is turned on by setting the EN pin high, and is turned off by pulling it low. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. DISCHARGE Operation The AP2281-3 offers discharge option that helps to discharge the output charge when disabled. Power Dissipation The device power dissipation and proper sizing of the thermal plane is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by: DSON 2 OUT D xR I P = (1) However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below: JA A A D ) T C 125 ( ) T (max@ P θ − ° + = (2) For example at VIN = 5V, the typical RDSON = 80mΩ. For IOUT = 2A, the maximum power dissipation calculated using equation (1) is PD = 0.32W. Based on SOT26 θJA = 153°C/W and equation (2), the calculated junction temperature rise from ambient is approximately 49°C. Since the maximum junction temperature is 125°C, the operating ambient temperature must be kept below 76°C to safely operate the device. On the other hand, at TA = 85°C and VIN = 5V, the calculated maximum power dissipation from equation (2) is approximately PDmax = 0.26W. Hence the safe operating maximum continuous current is 1.81A. For other application conditions, the users should recalculate the device maximum power dissipation based on the operating conditions. Application Note |
Similar Part No. - AP2281_09 |
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Similar Description - AP2281_09 |
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