Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Product Dimensions

Recommended Pad Layout

Pad #

Apply

1

In1

2NC

3

Out1

4

Out2

5NC

6

In2

NC = Solder to PCB; do not make electrical

connection, do not connect to ground.

Pad Designation

define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil

opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power

device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini-

mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the

pads of the device.

Block Diagram

Thermal Resistances

Symbol

Parameter

Value

Unit

Junction to leads (package)

105

°C/W

Junction to leads (per TBU)

202

°C/W

Reflow Profile

Profile Feature

Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp)

3 °C/sec. max.

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time (tsmin to tsmax)

150 °C

200 °C

60-180 sec.

Time maintained above:

- Temperature (TL)

- Time (tL)

217 °C

60-150 sec.

Peak/Classification Temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temp. (tp)

20-40 sec.

Ramp-Down Rate

6 °C/sec. max.

Time 25 °C to Peak Temperature

8 min. max.

PIN 1

A

B

D

C

4

3

6

1

5

2

E

J

J

N

N

H

P

G

K

L

F

TOP VIEW

SIDE VIEW

BOTTOM VIEW

H

DIMENSIONS:

MM

(INCHES)

Dim.

Min.

Typ.

Max.

A

6.15

(.242)

6.25

(.246)

6.35

(.250)

B

7.65

(.301)

7.75

(.305)

7.85

(.309)

C

0.80

(.031)

0.85

(.033)

0.90

(.035)

D

0.000

(.000)

0.025

(.001)

0.050

(.002)

E

0.50

(.020)

0.55

(.022)

0.60

(.024)

F

1.20

(.047)

1.25

(.049)

1.30

(.051)

G

4.20

(.165)

4.25

(.167)

4.30

(.169)

H

2.45

(.096)

2.50

(.098)

2.55

(.100)

J

0.20

(.008)

0.25

(.010)

0.30

(.012)

K

0.45

(.018)

0.50

(.020)

0.55

(.022)

L

0.65

(.026)

0.70

(.028)

0.75

(.030)

N

0.20

(.008)

0.25

(.010)

0.30

(.012)

P

0.70

(.028)

0.75

(.030)

0.80

(.031)

Q

3.20

(.126)

3.25

(.128)

3.30

(.130)

2.525

(.099)

0.50

(.020)

1.25

(.049)

0.575

(.023)

0.375

(.015)

0.70

(.028)

4.275

(.168)

6

4

1

3

TBU™ Device

Line

Side

Load

Side